By: Richard F. Yanda, Michael Heynes and Anne K. Miller

“Demystifying Chipmaking” introduces the semiconductor manufacturing steps in the first chapter and then introduces how the MOS transistors needed to form CMOS circuitry are built. Chapter two describes the support technologies of Contamination Control, Crystal Growth and Wafer Preparation, Integrated Circuit Design and Photomask and Reticle Preparation. The individual process steps are explained in detail when they are first utilized in the fabrication of the transistor. The additional chapters are: Forming Wells, Shallow Trench Isolation, Building the Transistors, First Level Metallization, Multi-Level Metal Interconnects using Dual Damascene and Test and Assembly.

This book provides an understandable account of the most current integrated circuit manufacturing processes. Semiconductor Industry professionals including manufacturing personnel as well engineering and marketing staffs of companies which supply chip makers will benefit from having this book on hand. Analysts and journalists who cover the semiconductor industry and members of the financial community will also find the book useful. The book was written to provide a comprehensive overview of contemporary chipmaking methods for readers seeking to broaden their understanding of this technology that affects the lives of most of the earth's population.

Table of Contents

• Chapter 1 - IC Fabrication Overview
• Chapter 2 - Support Technologies
• Chapter 3 - Forming Wells
• Chapter 4 - Insolate Active Areas (Shallow Trench Isolation)
• Chapter 5 - Building the Transistors
• Chapter 6 - First Level Metallization
• Chapter 7 - Multilevel Metal Interconnects and Dual Damascene
• Chapter 8 - Test and Assembly
• Appendix A - Science Overview
• Appendix B - Plasma Etch Supplement to Chapter 4