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  SEMI G011 - Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds
 
 
SEMI International Standards

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Product Code: STD-SEMI-G011

Description
 

This method describes a procedure for measuring the flow and gel characteristics of semiconductor grade transfer molding compounds using a ram follower device.

Referenced SEMI Standards
None.

Revision History
SEMI G11-88 (technical revision)
SEMI G11-83 (technical revision)
SEMI G11-81 (first published)

 

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