This specification defines lead finishes for plastic packages (e.g., single-in-line, dual-in-line, quad-in-line) using leadframes with SEMI-specified leadframe materials. This specification defines the composition, properties, and limits and refers to the appropriate tests for utility.

Referenced SEMI Standards
SEMI G4 — Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
SEMI G18 — Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes
SEMI G55 — Test Method Measurement of Silver Plating Brightness
SEMI G56 — Test Method Measurement of Silver Plating Thickness

Revision History
SEMI G20-96 (technical revision)
SEMI G20-84 (first published)