This test method describes the measurement method for the inductance of internal traces of semiconductor packages. This test method is applicable for the measurement of package inductance that is greater than 0.5 nH. This document describes the measurement of a pin grid array, one of the package types, as a sample. This test method is also applicable to other types of packages. The inductance in this document is limited to that of internal traces only and does not contain the portions contributed by the exposed areas such as pins and wires.

Referenced SEMI Standards
None.

Revision History
SEMI G23-0996 (technical revision)
SEMI G23-89 (technical revision)
SEMI G23-84 (first published)