This standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 13, 2008. It was available at www.semi.org in June 2008 and on CD-ROM in July 2008. Originally published 1998; previously published March 2007.

This standard specifies the front-opening shipping box (FOSB) used to ship 300 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality.

Refer to SEMI silicon wafer related specifications M-series such as SEMI M1 as for a wafer quality.

This standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. However, this standard has been written so that injection-molded plastic FOSBs can be manufactured in conformance with it, and those can be utilized for maintaining wafers quality during transportation, opening and closing the door.

This standard assumes that the FOSB is used in the last process in wafer manufacturing, in acceptance and inspection, and in transferring the wafers from the FOSB to a FOUP, FOBIT or open cassette inside an IC manufacturing facility. The FOSB is not intended to be used in IC manufacturing processes. It is recommended that wafers be transferred from the FOSB to a FOUP, FOBIT or open cassette using automated methods. As described in ¶ 5.4, the purchaser needs to specify which type of FOSB door is required:
Manual door as described in ¶ 5.4.1; or
Automated–shippable door as described in ¶ 5.4.2.

Referenced Standards:
SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E15 — Specification for Tool Load Port
SEMI E15.1 — Specification for 300 mm Tool Load Port
SEMI E47.1 — Mechanical Specification for FOUPS Used to Transport and Store 300 mm Wafers
SEMI E57 — Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers
SEMI E62 — Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)
SEMI E119 — Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory Transport of 300 mm Wafers
SEMI M45 — Provisional Standard for 300mm Wafer Shipping System
SEMI S8 — Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment

Revision History:
SEMI M31-0708 (technical revision)
SEMI M31-0307 (technical revision)
SEMI M31-0706 (technical revision)
SEMI M31-0306 (technical revision)
SEMI M31-1105 (technical revision)
SEMI M31-0705 (technical revision)
SEMI M31-0305 (technical revision)
SEMI M31-1104 (technical revision)
SEMI M31-1103E (editorial revision)
SEMI M31-1103 (technical revision)
SEMI M31-0303 (technical revision)
SEMI M31-0999 (technical revision)
SEMI M31-0699 (technical revision)
SEMI M31-0698 (first published)