This standard was technically approved by the global MEMS Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 21, 2006. It was available at www.semi.org in February 2007 and on CD-ROM in March 2007.

This test method enables the determination of step-height measurements of thin films. Step-height measurements can be used to determine thin-film thickness values. Thickness measurements are an aid in the design and fabrication of MEMS devices and can be used to obtain thin film material parameters, such as Young’s modulus.

This test method presents a procedure for measuring step-heights of thin, reflecting films using step-height test structures. It applies only to films, such as those found in microelectromechanical system (MEMS) materials, which can be imaged using an optical interferometer. A non-contact optical interferometer is used with the capability of obtaining topographical 3-D data sets.

Referenced SEMI Standards
None.

Revision History
SEMI MS2-0307 (first published)