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  SEMI MS007 - Specification for Microfluidic Interfaces to Electronic Device Packages
 
 
SEMI International Standards

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Product Code: STD-SEMI-MS007

Description
 

This standard was technically approved by the global MEMS Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 13, 2008. It was available at www.semi.org in June 2008 and on CD-ROM in July 2008.

This document defines an industry-standard for fluidic interfaces with electronic devices. The specification describes the connection attributes and specifies the interface dimensions required to design and build devices and systems that are compliant with this standard. The goal is to enable devices from different vendors to interconnect via an open architecture. The specification is intended as an enhanced capability to state-of-the-art electronic device technologies incorporating a combination of electronics and fluidics. It is intended to provide device users adequate room for product versatility and market differentiation without the burden of carrying obsolete interfaces, losing compatibility, and choice.

The specification is primarily targeted toward die manufacturers, design engineers, packaging engineers, chemical engineers, packaging equipment suppliers, peripheral developers and system OEMs. This specification can be used for developing new products and associated hardware.

Referenced Standards:
SEMI MS6-0308 — Guide for Design and Materials for Interfacing Microfluidic Systems

Revision History:
SEMI MS7-0708 (first published)

 

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