This specification defines the leak testing requirements and leakage rates for high-purity gas piping systems and components used in semiconductor manufacturing. It is also intended as an aid in the procurement and installation of equipment, materials, and services. This specification applies to high-purity gas piping systems and components used in semiconductor manufacturing facilities and comparable research and development areas. It includes testing methods for complete systems, subsystems, and individual components. It states requirements for both the user and manufacturer and establishes leak rate limits for acceptance testing and qualification testing.

Referenced SEMI Standards
SEMI S2 — Safety Guidelines for Semiconductor Manufacturing Equipment

Revision History
SEMI F1-96 (technical revision)
SEMI F1-0091 (first published)

This specification establishes the minimum design and performance requirements for pneumatically actuated cylinder valves used in semiconductor manufacturing. It is also intended as an aid in the procurement of these valves.

This specification applies to pneumatically actuated valves for use on cylinders containing gases used in semiconductor manufacturing facilities and in comparable research and development areas.

Referenced SEMI Standards
SEMI F1 — Specification for Leak Integrity of High-Purity Gas Piping Systems and Components
SEMI F19 — Specification for the Finish of the Wetted Surfaces of Electropolished 316L Stainless Steel Components
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications
SEMI F32 — Test Method for Determination of Flow Coefficient for High Purity Shutoff Valves
SEMI S5 — Safety Guideline for Flow Limiting Devices

Revision History
SEMI F4-1000 (technical revision)
SEMI F4-0200 (technical revision)
SEMI F4-0298 (technical revision)
SEMI F4-1990 (first published)

NOTICE: This document, as balloted, is intended to replace SEMI F5-90 in its entirety.

The purpose of this guide is to provide the semiconductor industry with the general knowledge and background information which will assist the industry in selecting and applying appropriate treatment methods and equipment for controlling emission of gaseous and particulate contaminant materials that may present hazards to manufacturing facilities, plant personnel, air quality, or the population at large.

This guide presents a review and evaluation of available information relative to: Chemical and physical properties of chemical compounds and elements that are or may be released from semiconductor manufacturing operations. Treatment methods for controlling emission of gaseous and particulate contaminants exhausted from semiconductor manufacturing operations. Specific control processes that are based on the general treatment methods and the data on contaminant properties. Types of codes of practice and legal regulations, in force or in preparation, that govern the release of contaminants from semiconductor manufacturing operations.

Referenced SEMI Standards
SEMI S2 — Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment
SEMI S5 — Safety Guideline for Flow Limiting Devices
SEMI S8 — Safety Guidelines Equipment for Ergonomics Engineering of Semiconductor Manufactoring Equipment

Revision History
SEMI F5-1101 (technical revision)
SEMI F5-0090 (first published)

To provide a guide for the design, fabrication, and operation of secondarily contained distribution piping for hazardous production material (HPM) gases. This guide covers the general requirements for hazardous production material distribution piping in those industries that are included under the H-6 Classification of the Uniform Building Code, or Articles 51 or 80 of the Uniform Fire Code, or of other applicable local codes. This guide does not include requirements for individual exhausted enclosures (e.g., valve boxes and gas cabinets).

Referenced SEMI Standards
SEMI F1 — Specification for Leak Integrity of Toxic Gas Piping Systems
SEMI S2 — Safety Guidelines for Semiconductor Manufacturing Equipment
SEMI S4 — Safety Guideline for the Segregation/Separation of Gas Cylinders Contained in Cabinets

Revision History
SEMI F6-92 (first published)

This method provides a uniform procedure to determine the tensile strength of tube fitting connections made of fluorocarbon materials. It can be used to characterize tube fitting connections on the basis of test data developed under the conditions described herein, but the results are not intended to imply a performance rating. Tube defined in this method has a circular cross section and is made of fluorocarbon materials. All parts of the tube fittings tested by this method in contact with the internal fluid are made of fluorocarbon materials. Parts such as a nut or gripper are not limited to being made of a fluorocarbon material. Only the seal between the tube and tube fitting being evaluated is within the scope of this document. All other, threaded seals are beyond the scope of this document. When using this method for making comparisons among various tube fittings and/or manufacturers, the user must be specific in the selection of the tube and tube fittings to be evaluated.

Referenced SEMI Standards
None.

Revision History
SEMI F7-92 (Reapproved 0299)
SEMI F7-0092 (first published)

This method provides a uniform procedure to determine the sealing capabilities of tube fitting connections made of fluorocarbon materials when the connections are subjected to tensile forces. It can be used to characterize tube fitting connections on the basis of test data developed under the conditions described herein, but the results are not intended to imply a performance rating. Tube defined in this method has a circular cross section and is made of fluorocarbon materials. All parts of the tube fittings tested by this method in contact with the internal fluid are made of fluorocarbon materials. Parts such as a nut or gripper are not limited to being made of a fluorocarbon material. Only the seal between the tube and tube fitting being evaluated is within the scope of this document. All other, threaded seals are beyond the scope of this document. When using this method for making comparisons between various tube fittings and/or manufacturers, the user must be specific in the selection of the tube and tube fittings to be evaluated.

Referenced SEMI Standards
None.

Revision History
SEMI F8-0998 (technical revison)
SEMI F8-0092 (first published)

This method provides a uniform procedure to determine the leakage characteristics of tube fitting connections made of fluorocarbon materials, when subjected to side loading. It can be used to characterize tube fitting connections on the basis of test data developed under the conditions described herein, but the results are not intended to imply a performance rating. Tube defined in this method has a circular cross section and is made of fluorocarbon materials. All parts of the tube fittings tested by this method in contact with the internal fluid are made of fluorocarbon materials. Parts such as a nut or gripper are not limited to being made of a fluorocarbon material. Only the seal between the tube and tube fitting being evaluated is within the scope of this document. All other, threaded seals are beyond the scope of this document. When using this method for making comparisons between various tube fittings and/or manufacturers, the user must be specific in the selection of the tube and tube fittings to be evaluated.

Referenced SEMI Standards
None.

Revision History
SEMI F9-0998 (technical revision)
SEMI F9-0092 (first published)

This method provides a uniform procedure to determine the internal pressure required to produce failure of fitting connections made of fluorocarbon materials. It can be used to characterize tube fitting connections on the basis of test data developed under the conditions described herein, but the results are not intended to imply a performance rating. Tube defined in this method has a circular cross section and is made of fluorocarbon materials. Tube fittings defined in this method are made of fluorocarbon materials for all parts in contact with the internal fluid. Parts such as a nut or gripper are not limited to being made of a fluorocarbon material. Only the seal between the tube and tube fitting being evaluated is within the scope of this document. All other, threaded seals are beyond the scope of this document. When using this method for making comparisons among various tube fittings and/or manufacturers, the user must be specific in the selection of the tube and tube fittings to be evaluated.

Referenced SEMI Standards
None.

Revision History
SEMI F10-0698 (technical revision)
SEMI F10-0093 (first published)

This method provides a uniform procedure to determine the thermal characteristics of tube fitting connections made of fluorocarbon materials. It can be used to characterize tube fitting connections on the basis of test data developed under the conditions described herein, but the results are not intended to imply a performance rating. Tube defined in this method has a circular cross section and is made of fluorocarbon materials. Tube fittings defined in this method are made of fluorocarbon materials for all parts in contact with the internal fluid. Parts such as a nut or gripper are not limited to being made of a fluorocarbon material. Only the seal between the tube and tube fitting being evaluated is within the scope of this document. All other, threaded seals are beyond the scope of this document. When using this method for making comparisons among various tube fittings and/or manufacturers, the user must be specific in the selection of the tube and tube fittings to be evaluated.

Referenced SEMI Standards
None.

Revision History
SEMI F11-0998 (technical revision)
SEMI F11-0093 (first published)

This method provides a uniform procedure to determine the sealing capabilities of fluorocarbon resin fittings, after they have been subjected to an elevated ambient temperature and cooled to room temperature (hereafter referred to as a "Heat Cycle"). This method can be used to characterize the thermal characteristics of tube fitting connections on the basis of test data obtained under the conditions described herein, but the results are not intended to imply a performance rating. When using this test method, a fitting body temperature range of 23°-125°C (73°-257°F) should be maintained. Tube defined in this method is made of fluorocarbon materials. Tube fittings defined in this method are made of fluorocarbon materials for all parts in contact with the internal fluid. Parts such as nuts and grippers are not limited to being made of a fluorocarbon material. Only the seal between the tube and tube fitting being evaluated is within the scope of this document. All other seals are beyond the scope of this document. When using this method for making comparisons between various tube fitting manufacturers, the user must be specific in the selection of the tube and tube fittings to be evaluated.

Referenced SEMI Standards
None.

Revision History
SEMI F12-0998 (technical revision)
SEMI F12-0093 (first published)

The purpose of this document is to provide a guide for the design and operational requirements of gas source control equipment which is used to control pressure and flow from a gas cylinder to the point of use. This document describes the components and minimum performance criteria for gas source control equipment used with hazardous production material (HPM) semiconductor gases. This guide also includes recommended component functions and operating requirements.

Referenced SEMI Standards
None.

Revision History
SEMI F13-1101 (technical revision)
SEMI F13-93 (first published)

This document summarizes gas source equipment enclosure design considerations. It is intended for use by manufacturers and purchasers. Design considerations pertaining to gas source equipment enclosures are described herein. Modifications required to accommodate specific gases, cylinders, or unusual applications (e.g., process equipment) are not addressed.

Referenced SEMI Standards
SEMI S4 — Safety Guideline for the Segregation/ Separation of Gas Cylinders Contained in Cabinets

Revision History
SEMI F14-93 (Reapproved 0699)
SEMI F14-0093 (first published)

This standard was technically approved by the global Environmental, Health, and Safety Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 20, 2007. It was available at www.semi.org in February 2008 and on CD-ROM in March 2008. Originally published in 1993; previously published November 2004.

The purpose of this document is to provide a permanent withdrawal notice for SEMI F15 indicating that the technical content has been superseded by Appendix 2, Test Method for Determining Fugitive Emissions by Using Tracer Gas of SEMI S6.

In the event that SEMI changes their document withdrawal process so that withdrawn document notices do not automatically disappear after two years, this document may be formally withdrawn.

The scope of this document is all of the content of SEMI F15-93 (Reapproved 1104).

Referenced Standards:
SEMI S6 — EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment
SEMI F15-93 (Reapproved 1104) — Test Method for Enclosures Using Sulfur Hexafluoride Tracer Gas and Gas Chromatography

Revision History:
SEMI F15-0308 (technical revision)
SEMI F15-93 (Reapproved 1104)
SEMI F15-93 (Reapproved 0699)
SEMI F15-0093 (first published)

To identify a test method for measuring the hydrostatic strength of thermoplastic pipe and tubing, a method for estimating long-term hydrostatic strength, and recommendations for developing design bases. This guide references the industry-recognized Standard Test Method for determining the time-to-failure of plastic pipe under constant internal pressure. This guide references the industry-recognized Standard Test Method for determining the long-term hydrostatic strength of plastic pipe in order to obtain the hydrostatic design basis of the pipe material. This guide references the Technical Report of policies and procedures for developing recommended hydrostatic design stresses for thermoplastic pipe materials from 23°C to 93.3°C (73°F to 00°F).

Referenced SEMI Standards
None.

Revision History
SEMI F18-0095 (first published)

The purpose of this specification is to provide a standard for the quality of the wetted surfaces of stainless steel components used in the chemical (gas and liquid) distribution systems of semiconductor manufacturing facilities. This specification defines the wetted surface characterization requirements and the finish acceptance criteria for tubing and components fabricated in stainless steel per SEMI F20 and intended to control and/or contain gases and liquids used in semiconductor manufacturing. The surface characterization tests to be performed are specified herein, and the existing standards for performing these tests are referenced. Terms specific to this technology are either listed herein as they relate to the acceptance criteria of this specification or are defined in the referenced documents as they relate to a specific test method.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications
SEMI F37 — Method for Determination of Surface Roughness Parameters for Gas Distribution System Components
SEMI F60 — Test Method for ESCA Evaluation of Surface Composition of Wetted Surfaces of Passivated 316L Stainless Steel Components
SEMI F70 — Test Method for Determination of Particle Contribution of Gas Delivery System
SEMI F72 — Test Method for Auger Electron Spectroscopy (AES) Evaluation of Oxide Layer of Wetted Surfaces of Passivated 316L Stainless Steel Components
SEMI F73 — Test Method For Scanning Electron Microscopy (SEM) Evaluation of Wetted Surface Condition of Stainless Steel Components
SEMI F77 — Test Method for Electrochemical Critical Pitting Temperature Testing of Alloy Surfaces Used in Corrosive Gas Systems

Revision History
SEMI F19-0304 (complete rewrite)
SEMI F19-0095 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 16, 2006. It was available at www.semi.org in June 2006 and on CD-ROM in July 2006. Originally published 1995; previously published March 2005.

E This standard was editorially modified in October 2006 to correct a section numbering error. Changes were made to Appendix 1, § A1-2.

The purpose of this specification is to define the metallurgical cleanliness requirements and material composition of 316L stainless steel required for use in the manufacture of components for general purpose, high purity, and ultra-high purity chemical (gas or liquid) distribution systems.

This specification defines the requirements for 316L stainless steel bar, forgings, and extruded shapes as specified in ASTM A276, plate stock as specified in ASTM A240, and tubing as specified in ASTM A269 and ASTM A632, for use in the manufacture of components used in general purpose and high purity chemical (gas or liquid) distribution systems in semiconductor manufacturing facilities.

Referenced SEMI Standards
None.

Revision History
SEMI F20-0706E (editorial revision)
SEMI F20-0706 (technical revision)
SEMI F20-0305 (technical revision)
SEMI F20-0704 (technical revision)
SEMI F20-0997 (technical revision)
SEMI F20-95 (first published)

This classification was technically approved by the Global Facilities Committee and is the direct responsibility of the North American Facilities Committee. Current edition approved by the North American Regional Standards Committee on August 29, 2002. Initially available at www.semi.org September 2002; to be published November 2002. Originally published in 1995.

The purpose of this standard is to classify microelectronics clean environments with respect to their molecular (non-particulate) contaminant levels. This standard classification provides a consistent means of communicating acceptable contaminant levels of groups of specific airborne molecular contaminants. This standard classification is to be used in the specification of semiconductor clean environments (including process tool environments) and of contamination control and measurement equipment performance.

Referenced SEMI Standards
None.

Revision History
SEMI F21-1102 (technical revision)
SEMI F21-0095 (first published)

This reference document is intended to outline for the user the common systems configurations, components, and subcomponents of high purity gas distribution systems in a semiconductor fabrication facility. Related specifications are also noted. Outlined in this document are both bulk and specialty gas distribution systems. Components and subcomponents are identified from the point-of-supply to the point-of-connection to the process tool.

Referenced SEMI Standards
None.

Revision History
SEMI F22-1102 (technical revision)
SEMI F22-0697 (first published)

The purpose of this document is to set a maximum permissible particle concentration for 10/0.2 grade flammable specialty gases and to describe a reference method for its verification. This document applies only to flammable gases delivered through specialty gas systems at pressures up to 8 x 105 Pa (8 atmospheres). This method is not suitable for direct sampling from high pressure cylinders at pressures above 8 x 105 Pa (8 atmospheres). This document applies only to the following gas: Hydrogen (H2).

Referenced SEMI Standards
SEMI C6.3 — Particle Specification for Grade 20/0.2 Hydrogen (H2) Delivered as Pipeline Gas

Revision History
SEMI F23-0697 (first published)

The purpose of this document is to set a maximum permissible particle concentration for 10/0.2 grade inert specialty gases and to describe a reference method for its verification. This document applies only to inert gases delivered through specialty gas systems at pressures up to 8 x 105 Pa (8 atmospheres). This method is not suitable for direct sampling from high pressure cylinders at pressures above 8 x 105 Pa (8 atmospheres). This document applies only to the following gases: Argon (Ar), Halocarbon 23 (CHF3), Halocarbon 116 (C2F6), Helium (He), Nitrogen (N2), Sulfur Hexafluoride (SF6), and Tetrafluoromethane (CF4).

Referenced SEMI Standards
SEMI C6.5 — Particle Specification for Grade 10/0.2 Nitrogen (N2) and Argon (Ar) Delivered as Pipeline Gas

Revision History
SEMI F24-0697 (Reapproved 0303)
SEMI F24-0697 (first published)

The purpose of this document is to set a maximum permissible particle concentration for 10/0.2 grade oxidant specialty gases and to describe a reference method for its verification. This document applies only to oxidant gases delivered through specialty gas systems at pressures up to 8 x 105 Pa (8 atmospheres). This method is not suitable for direct sampling from high pressure cylinders at pressures above 8 x 105 Pa (8 atmospheres). This document applies only to the following gases: Oxygen (O2), Nitrous Oxide (N2O), and Nitrogen Trifluoride (NF3).

Referenced SEMI Standards
SEMI C6.2 — Particle Specification for Grade 20/0.02 Oxygen Delivered as Pipeline Gas

Revision History
SEMI F25-0697 (Reapproved 0303)
SEMI F25-0697 (first published)

The purpose of this document is to set a maximum permissible particle concentration for 10/0.2 grade toxic specialty gases and to describe a reference method for its verification. This document applies only to toxic gases delivered through specialty gas systems at pressures up to 8 x 105 Pa (8 atmospheres). This method is not suitable for direct sampling from high pressure cylinders at pressures above 8 x 105 Pa (8 atmospheres).

This document applies only to the following gases: Ammonia (NH3), Arsine (AsH3), and Phosphine (PH3).

Referenced SEMI Standards
None.

Revision History
SEMI F26-0697 (Reapproved 0303)
SEMI F26-0697 (first published)

This test will determine the quantity of removable moisture and the degree of interaction with trace concentrations of gas phase moisture, of gas distribution systems and components. APIMS is currently the technique of choice for such tests because it is essentially the only commercially available method capable of ppt moisture analysis and because of its superior response time.

This method may provide guidelines for the application of other techniques with similar detection limits and response time to APIMS which are not commercially available at this time. The results of this test can be used for qualitative ranking of systems and components and can also be used, by a sufficiently sophisticated user, as input for numerical simulation of distribution system behavior.

Referenced SEMI Standards
SEMI C15 — Test Method for ppm and ppb Humidity Standards

Revision History
SEMI F27-0997 (Reapproved 1103)
SEMI F27-0997 (first published)

The purpose of this document is to define a method for testing process panels intended for installation in high-purity gas distribution systems. Application of this test method is expected to yield comparable data among process panels tested for the purposes of qualification for this installation. This document describes a test method designed to draw comparisons of particulate generation performance of process panels.

This test method evaluates the cleanliness of process panels in the "as received" condition as well as under normal operating conditions. The "as received" test is intended to enable the user to evaluate the fabrication, cleaning, and packaging techniques of the manufacturer of the process panel. The test under actual operating conditions is intended to allow the user to evaluate the manufacturer's component selection as well as the quality of the panel design. The specific flow rates described in both test methods are representative of relatively high flow conditions for a typical process panel. This test method addresses total particle counts greater than the minimum detection limit (MDL) of the particle counter and does not consider classifying data into various size ranges.

This procedure utilizes a particle counter applied to process panels typically used in semiconductor applications. It applies to process gas supply systems (e.g., gas cabinets) which include a process panel, an inert purge panel, and a system vent. Both automatic and manual process panels are within the scope of this test procedure. Panels, as defined in this test method, are considered to consist of 6.35 mm O. D. x 0.89 mm wall (1/4" O.D. x 0.035" wall) tubing and components.

Referenced SEMI Standards
None.

Revision History
SEMI F29-1103 (technical revision)
SEMI F28-0997 (first published)

This document defines the purge efficacy test method recommended for determining the minimum acceptable level of purge efficacy for gas source systems used in semiconductor manufacturing. It is also intended as an aid to the procurement of gas source equipment. This specification applies to gas source equipment used in semiconductor manufacturing facilities and comparable research and development areas. It includes contamination testing requirements for gas source systems.

The tests covered by this document are as follows: purge efficacy with a non-interactive gas using manufacturers' standard purge sequence, purge efficacy with a non-interactive gas using the test method specified purge sequence, purge efficacy with an interactive gas using manufacturers' standard purge sequence, and purge efficacy with an interactive gas using the test method specified purge sequence.

Referenced SEMI Standards
None.

Revision History
SEMI F29-0997 (Reapproved 1103)
SEMI F29-0997 (first published)

The purpose of this procedure is to verify the performance of purifiers by employing analytical instrumentation to measure gas impurities and particles to customer specifications. If specific inlet challenge(s) and/or inlet measurements are required, it should be discussed beforehand with the customer. Inlet impurities must be measured by part-per-million (PPM) or part-per-billion (PPB) analytical equipment.

This procedure applies only to large scale bulk purifiers rated at greater than 50 liters-per-minute (LPM) flowrate. Verify performance of large scale purifiers in nitrogen, argon, helium, oxygen, and hydrogen service. Verification tests are done at PPB or sub-PPB levels of gaseous impurities and sub-micron sizes of particles measured downstream of any installed filter modules. Tests are done at maximum achievable flow of purifier, and/or customer's specified percentages of maximum flow.

Referenced SEMI Standards
None.

Revision History
SEMI F30-0298 (first published)

This guide defines components of Bulk Chemical Distribution Systems and sets forth Basic Design Elements and optional design features common to BCD Systems.

This guide applies to BCD Systems used in semiconductor manufacturing facilities for supplying liquid chemicals to wafer cleaning and other manufacturing processes.

Referenced SEMI Standards
SEMI E49 — Guide for Standard Performance, Practices, and Sub-Assembly for High Purity Piping Systems and Final Assembly for Semiconductor Manufacturing Equipment
SEMI S2 — Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment

Revision History
SEMI F31-0698 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 16, 2006. It was available at www.semi.org in June 2006 and on CD-ROM in July 2006. Originally published in 1998.

This test method describes how to determine two criteria used in selecting valves of appropriate size for gases and liquids. Methods and equations are specified and/or referenced to assist in accurate calculation of pressure drops across valves tested by this method.

This method establishes the testing criteria for determination of two coefficients specified in ANSI/ISA-S75.02:
· Valve flow coefficient (Cv )
· Critical pressure drop ratio factor (xT)

This method is to be used with ANSI/ISA-S75.02. This method applies to manual and actuated valves for use in both gas and liquid distribution systems used in semiconductor manufacturing facilities. It is a test method, where existing test methods are referenced and limitations are imposed on test conditions. Specific equations for calculating flow coefficients, choked flow parameters, and pressure drops are referenced to the appropriate ISA section.

Referenced SEMI Standards
None.

Revision History
SEMI F32-0706 (technical revision)
SEMI F32-0998 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 13, 2008. It was available at www.semi.org in June 2008 and on CD-ROM in July 2008. Originally published in 1998.

This test method may provide guidelines for the calibration of the APIMS for measurement of impurities in nitrogen, argon, helium and hydrogen. APIMS is currently the technique of choice for measurements of low level impurities in gas distribution systems and components because it is essentially the only commercially available method capable of ppt impurity analysis and it has a superior response time. This method may provide guidelines for application of other techniques with similar detection limits and response time to APIMS which may not be commercially available at this time.

This method applies to the analyte calibration of the APIMS for a target impurity range of 100 ppt to as high as 200 ppb impurity range. The actual calibration range should bracket the impurity measurement range of interest, dependent upon the measurement to be conducted. Anything else is outside the range of the calibration.

Referenced Standards:
SEMI C9.1 — Guide for Analysis of Uncertainties in Gravimetrically Prepared Gas Mixtures
SEMI C15 — Test Method for ppm and ppb Humidity Standards

Revision History:
SEMI F33-0708 (technical revision)
SEMI F33-0998 (first published)

This document establishes a recommended scheme for labeling liquid process chemical piping systems used in semiconductor manufacturing facilities and equipment. A consistent labeling system acilitates rapid identification of piping contents and avoids confusion within the industry by eliminating the need for each company or locality to develop their own guides. This guide applies to components typically found in a liquid process chemical piping system for semiconductor manufacturing processes. The following list of included components is not exhaustive: piping, valves, filters, regulators and tubing.

Referenced SEMI Standards
None.

Revision History
SEMI F34-0998 (first published)

This test method applies to UHP gas distribution systems used in semiconductor manufacturing facilities and comparable research and development areas. This test method applies to bulk gas distribution systems carrying UHP gases such as N2, Ar, He, H2, N2O, SF6, and many halocarbons. In most cases, O2 is present only in ultra-low trace levels (typically less than 1.0 ppb).

This test method will provide real-time monitoring of UHP gas distribution systems, resulting in meaningful system integrity verification, atmospheric contaminant trending analysis, and leak locating.

This test method will provide the user with sufficient information to identify and troubleshoot sources of atmospheric leakage into the UHP gas distribution system.

This test method includes the specification of the required O2 analytical equipment, standard methods for proper use of the O2 analytical equipment, and manipulation of the O2 data in identifying atmospheric leak sources.

Referenced SEMI Standards
SEMI F1 — Specification for Leak Integrity of HighPurity Gas Piping Systems and Components

Revision History
SEMI F35-0304 (technical revision)
SEMI F35-0998 (first published)

This standard was technically approved by the Global Gases Committee and is the direct responsibility of the North American Gases Committee. Current edition approved by the North American Regional Standards Committee on July 11, 2004. Initially available at www.semi.org September 2004; to be published November 2004. Originally published in 1993; last published February 1999.

The purpose of this guide is standardization of dimensional and mechanical/electrical connection attributes for components used within gas distribution systems. Standardization of these component interfaces will allow for interchangeability of gas distribution system components. Filters/purifiers, shut-off valves, pressure regulators, MFC/MFMs, and pressure transducers are the types of gas distribution components that would benefit from being interchangeable.

This guide is for use with 1/4-inch distribution systems at operating pressures no greater than 345 kPa (50 psi).

The guide includes the following items: Physical characteristics specific to each component. These include a generalized drawing of the component, specific end-to-end lengths for each type of end connection, maximum envelope dimensions, base-to-centerline dimensions, tolerances, and bottom mounting information. Electrical connections specific to each component, where applicable. These include pin-outs and types of connectors.

Referenced SEMI Standards
None.

Revision History
SEMI F36-0299 (Reapproved 1104)
SEMI F36-0299 (first published)

This guideline was technically approved by the Global Gases Committee and is the direct responsibility of the North American Gases Committee. Current edition approved by the North American Regional Standards Committee on July 11, 2004. Initially available at www.semi.org September 2004; to be published November 2004. Originally published February 1999.

The purpose of this test method is to define a method for determining numerical values for surface roughness parameters measured on gas distribution system components. Application of this method is intended to yield comparable data among users of this method. This document will specify methods, measuring equipment, and test conditions for mechanical profile surface roughness measurement of gas distribution system components.

This test method will not require nor recommend numerical values for specific surface roughness parameters. This test method is intended for use in quality control and process development for specification of and manufacturing of gas distribution system components.

Referenced SEMI Standards
None.

Revision History
SEMI F37-0299 (Reapproved 1104)
SEMI F37-0299 (first published)

The purpose of this document is to define a comprehensive standard test sequence to qualify the particle filtration efficiency achievable using Point-of-Use (POU) gas filters. This test method defines an evaluation method for Point-of-Use filters of various media (e.g., metallic, ceramic, and polymeric) typically used for filtering inert and process gases in semiconductor applications. Point-of-Use filters are designed to handle relatively low flow rates (0.5-50 slm.) and moderately high pressure drops. The filter housing and filtration element are combined into one sealed and inseparable unit.

This test method is intended to demonstrate the ability of a Point-of-Use gas filter to equal or exceed a specific particle filtration efficiency class when challenged with a monodispersed aerosol in the size range described in Section 6.6.

The efficiency class of the test method is defined as the log reduction value (LRV), where LRV is the Log [Input Concentration/System Background Level].

Referenced SEMI Standards
None.

Revision History
SEMI F38-0699 (Reapproved 1104)
SEMI F38-0699 (first published)

This guideline establishes terminology, classification, performance characterization, and qualification methods for chemical blending equipment. This guideline applies to chemical blending equipment interfaced with Bulk Chemical Distribution Systems (BCDS).

Referenced SEMI Standards
SEMI F31 — Guide for Bulk Chemical Distribution Systems

Revision History
SEMI F39-0699 (first published)

This document defines component preparation and pretreatment procedures for chemical test methods used to evaluate liquid chemical distribution system components. This document includes preparation procedures that can be applied to components such as tubing, piping, valves, regulators, fittings, gaskets, O-rings, and filter housings.

This document defines and specifies all of the component pretreatment and analyze preparation procedures for liquid chemical distribution system components common to the test methods listed (see Table 3). Each type of component should be pretreated and prepared according to the procedures of this document before it can be tested using the identified chemical test methods. This document defines preparation and pretreatment procedures used for the evaluation of liquid chemical distribution system components in test fluids.

This practice is intended for use with 49% HF, 30% H2O2, 29% NH4OH, IPA and ultrapure water. The document defines the purity of chemicals that can be used for leaching and rinsing liquid chemical distribution system components.

Referenced SEMI Standards
None.

Revision History
SEMI F40-0699E (editorial revision)
SEMI F40-0699 (first published)

This Guide sets forth a logical and systematic approach to the qualification of a Bulk Chemical Distribution System that may be used by users and suppliers as a basis for developing site-specific BCDS specifications and performance criteria. The qualification process includes evaluation of chemical from the chemical source, the fluid transfer system, the distribution piping, the day tank, as well as other intermediary points of transfer and storage that may be included in the qualification plan.

This guide assumes that the BCDS has been installed per the BCDS manufacturer's recommendations and the customer's specifications, and has been appropriately leak tested and shown to meet all requirements of mechanical and physical integrity up to the POU. BCDS are typically tested for particle levels and trace metal impurities according to specified levels agreed upon in advance. For certain applications or specific chemicals, other testing may become incorporated in the qualification process. These other tests may include assay analysis, anion analysis, TOC analysis, moisture analysis, etc.

Referenced SEMI Standards
SEMI S2 — Safety Guideline for Semiconductor Manufacturing Equipment
SEMI E4 — Guide for Standard Performance, Practices, and Sub-Assembly for High Purity Piping Systems and Final Assembly for Semiconductor Manufacturing Equipment
SEMI F31 — Guide for Bulk Chemical Distribution Systems

Revision History
SEMI F41-0699 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 20, 2007. It was available at www.semi.org in February 2008 and on CD-ROM in March 2008. Originally published June 1999.

The purpose of this document is to define a method for testing POU purifiers and filters intended for installation into a high-purity gas distribution system and semiconductor manufacturing process equipment. Application of this test method is expected to yield comparable data among POU purifiers and filters tested for the purposes of qualification for its installation.

This document describes a test method designed to draw comparisons of particulate generation performance of POU purifiers and filters tested under standard conditions. The procedure utilizes a condensation nucleus counter (CNC) applied to in-line gas filters and purifiers typically used in semiconductor applications. This test method applies to devices of various media and for room temperature operation. The purifier’s rated flow should be in the range of 0–50 standard liter per minute (slm). The flow rate for filters should be in the range 0–100 slm. If this method is to be used for higher flow rate devices, the testing parameters should be agreed upon by the manufacturer and the user.

The experimental set up described in this method can be used for testing POU purifiers and stand-alone POU filters.

Referenced Standards:
SEMI E49.8 — Guide for High Purity and Ultrahigh Purity Gas Distribution Systems in Semiconductor Manufacturing Equipment
SEMI F19 — Specification for the Surface Condition of the Wetted Surfaces of Stainless Steel Components
SEMI F70 — Test Method for Determination of Particle Contribution of Gas Delivery System

Revision History:
SEMI F43-0308 (technical revision)
SEMI F43-0699 (first published)

This standard was technically approved by the global Facilities Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on January 18, 2007. It was available at www.semi.org in February 2007 and on CD-ROM in March 2007. Originally published June 1999.

The purpose of this specification is to prevent confusion among the manufacturers of stainless steel weld fittings, piping fabricators and end users and to standardize the dimensions of weld fittings.

This specification applies to 6.35 mm (1/4in.), 9.53 mm (3/8in.) and 12.7 mm (1/2in.); the machined stainless steel weld fittings elbows and tees made for use in the semiconductor industry.

Referenced SEMI Standards
None.

Revision History
SEMI F44-0307 (technical revision)
SEMI F44-0699 (first published)

This standard was technically approved by the global Facilities Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on January 18, 2007. It was available at www.semi.org in February 2007 and on CD-ROM in March 2007. Originally published June 1999.

The purpose of this specification is to prevent confusion among the manufacturers of stainless steel reducing weld fittings, piping fabricators and end users and to standardize the dimensions of weld fittings.

This specification applies to 6.35 mm (1/4 in.), 9.53 mm (3/8 in.) and 12.7 mm (1/2 in.); the machined stainless steel reducing weld fittings elbows and tees made for use in the semiconductor industry.

Referenced SEMI Standards
None.

Revision History
SEMI F45-0307 (technical revision)
SEMI F45-0699 (first published)

This guide establishes the minimum System and Overall Implementation requirements for requirement of On-Site Chemical Generation (OSCG) used in semiconductor manufacturing. It is also intended to establish a common basis for developing detailed guides in subsequent documents concerning design, performance, and certification of OSCG systems.

This guide applies to the OSCG system design used for the generation of chemicals, particularly ultra high purity, used in the silicon wafer, integrated circuit, and/or substrate manufacturing processes. These will include, but are not limited to, various concentrations of NH4OH, HCl, HF, and NH4F aqueous solutions.

Referenced SEMI Standards
SEMI S2 — Safety Guidelines for Semiconductor Manufacturing Equipment

Revision History
SEMI F46-0999 (first published)

This standard was technically approved by the global Facilities Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 16, 2006. It was available at www.semi.org in June 2006 and on CD-ROM in July 2006. Originally published September 1999; Previously published February 2000.

NOTICE: This document was completely rewritten in 2006. This document replaces SEMI F47-0200 and SEMI F42-0600.

Semiconductor factories require high levels of power quality due to the sensitivity of equipment and process controls. Semiconductor processing equipment is especially vulnerable to voltage sags. This specification defines the voltage sag immunity required for semiconductor processing, metrology, and automated test equipment. This specification strikes a balance between voltage sag immunity and increased equipment cost.

NOTE 1: The requirements and recommendations in this international specification were developed to satisfy semiconductor industry needs. While differing from other generic requirements, this industry-specific set of requirements and recommendations is not in conflict with known generic equipment regulations from other regions or generic equipment specifications from other organizations.

NOTE 2: To minimize design effort and testing, this revision aligns SEMI F47 test methods with applicable IEC standards, while retaining the previous SEMI F47 test levels. It also incorporates knowledge gained in the first five years of experience with this specification.

This specification sets minimum voltage sag immunity requirements for equipment used in the semiconductor industry. Immunity is specified in terms of voltage sag depth (in percent of nominal voltage remaining during the sag) and voltage sag duration (in cycles or seconds). This specification also sets procurement requirements, test methods, pass/fail criteria, and test report requirements.

The primary focus of this specification is semiconductor processing equipment including but not limited to the following types:
· Etch equipment (Dry & Wet)
· Film deposition equipment (CVD & PVD)
· Thermal equipment
· Surface prep and clean equipment
· Photolithography equipment (Scanner, Stepper & Tracks)
· Ion Implant equipment
· Metrology equipment
· Automated test equipment
· Chemical Mechanical Polishing/Planarization equipment

The secondary focus of this specification is subsystems and components that are used in the construction of semiconductor processing equipment, including but not limited to:
· Power supplies
· Radio frequency generators and matching networks
· Ultrasonic generators
· Computers and communication systems
· Robots and factory interfaces
· AC Contactor coils and AC relay coils
· Chillers and cryo pumps
· Pumps and blowers
· Adjustable speed drives

This specification applies to semiconductor processing equipment to include the equipment mainframe and all subsystems whose electrical power is directly affected by the operation of the equipment’s EMO (emergency off) system.

Grandfather Clause- Equipment, subsystems, and components that were tested or certified under the previous version of this specification, prior to the publication date of this specification, do not require re-testing or re-certification until hardware or software design changes that could affect voltage sag immunity are implemented.

Referenced SEMI Standards
SEMI E51 — Guide for Typical Facilities Services and Termination Matrix
SEMI S2 — Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment

Revision History
SEMI F47-0706 (technical revision)
SEMI F47-0200 (technical revision)
SEMI F47-0999 (first published)

This test method provides a procedure for determining the nonvolatile trace inorganic impurities in bulk polymeric materials. Following digestion by dry ashing (DDA) or digestion in closed vessel (DCV) preparation techniques, samples previously obtained and cleaned according to SEMI F40 are analyzed for trace inorganics using inductively coupled plasma-mass spectrometry (ICP-MS), graphite furnace atomic absorption spectroscopy (GFAAS), and/or inductively coupled plasma-atomic emission spectroscopy (ICP-AES). Materials for analysis include, but are not limited to: Raw polymer materials (resins), such as pellets of perfluoroalkoxy (PFA), polyvinylidene fluoride (PVDF), ethylenechlorotrifluoroethylene (ECTFE), polyetheretherketone (PEEK), polypropylene (PP), polyethylene (PE), acetal resin, polyvinyl chloride (PVC), Perfluoromethylether-based Perfluoro-alkoxy (MFA) and powders of polytetrafluoro-ethylene (PTFE). Polymer components of tubing, piping, fittings, valves, regulators, filter housings, filter cartridges, O-rings and gaskets used in ultrapure water (UPW) and liquid chemical distribution systems (LCDS). Ion-exchange resins. Polymer products used in the manufacturing of semiconductor devices, such as wafer carriers and wands, as well as accessories internal to wet equipment (e.g., drums in spin rinse dryers, tanks in quick dump rinsers). The DDA sections of this document refer to an ashing technique, whereby the sample is placed into a platinum or quartz crucible and thermally decomposed. Thermal decomposition in muffle furnace or microwave muffle furnace may also be used. Additionally, oxygen plasma may be used separately or in conjunction with these techniques. The DCV sections of this document refer to closed vessel microwave acid decomposition at elevated temperature and pressure. Alternatively closed vessel thermal conduction heating may also be applied. ICP-MS, GFAAS, and ICP-AES are all appropriate methods for inorganic analysis. ICP-MS is the preferred method because it is more sensitive and efficient. Alternate procedures may be used if they meet the same analytical performance criteria. Each laboratory is responsible for verifying the validity of each test method within its own operation. This test method may be used for other materials, or other nonvolatile elements, if the end-user wishes and performance is demonstrated for the analyte of interest, in the matrices of interest, at the concentration levels of interest.

Referenced SEMI Standards
SEMI F40 — Practice for Preparing Liquid Chemical Distribution Components for Chemical Testing

Revision History
SEMI F48-0600 (technical revision)
SEMI F48-0200 (first published)

A guide defining a systems approach to power conditioning is needed for semiconductor and flat panel display (FPD) facilities. Semiconductor and FPD factories require high levels of power quality due to the sensitivity of equipment and process controls. Semiconductor and FPD processing equipment is especially vulnerable to voltage sags. The facility electrical system distributes power to process equipment, support equipment, and facility infrastructure equipment. Facility electrical distribution systems should be designed to integrate the voltage sag susceptibility of all the equipment with the power quality supplied by the utility. Installing effective and efficient facilities power conditioning requires identification of appropriate conditioning technologies and properly applying the conditioning equipment. Utilizing recommendations in this guide should result in effective power conditioning of the facility electrical distribution system such that the process equipment, associated support equipment and facilities infrastructure equipment function within acceptable ranges.

This guide is intended for facilities engineers, equipment engineers, and facilities managers who specify compatibility requirements for equipment and utility services, and in particular for electrical power requirements such as those found in SEMI E51. This document provides recommendations for implementing a systems approach to identification and resolution of voltage sag events that disturb the performance of semiconductor process equipment. A program recommending facilities electrical distribution system monitoring and control strategies for both the direct and indirect effect of voltage sags on wafer processing is outlined as follows: reasons for monitoring and conditioning, facilities electrical distribution system power monitoring and conditioning, quantifying process equipment performance, quantifying support equipment and facilities infrastructure equipment performance, utility power monitoring strategies, measurement and modeling strategies, and power enhancing and conditioning strategies for use in the facilities electrical distribution system.

Referenced SEMI Standards
SEMI S2 — Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment
SEMI E51 — Guide for Typical Facilities Services and Termination Matrix

Revision History
SEMI F49-0200 (first published)

This guide provides a framework for semiconductor and flat panel display (FPD) manufacturers and their electric utility service providers to minimize the effect of voltage sag events on semiconductor processing. In particular, this guide focuses on electric utility power quality performance goals that are complementary to voltage sag immunity levels for semiconductor processing equipment and facilities infrastructure equipment. Recommendations for measuring and evaluating voltage sag performance, evaluating utility system enhancements, and implementation of a continuous improvement process are included since no electric utility industry standards exist. Utility systems are designed, constructed, and operated to meet utility industry regulations and requirements. One important requirement for semiconductor factories is power system reliability. Utilities measure reliability in minutes of voltage outages per customer per year. Semiconductor factories require a high level of power system reliability, any service outage is usually unacceptable. A second important requirement is power quality. Power quality relates to disturbed voltage waveforms, not outages. When utilities implement measures to increase power system reliability, power quality can be adversely affected. The structured approach defined in this guide can achieve high levels of power quality without sacrificing power reliability. The intent of this guide is to help semiconductor manufacturers achieve both high levels of power reliability and power quality from energy utility providers. By becoming familiar with the cause and effect relationships of voltage sag events on the utility’s side of the electric meter, semiconductor manufacturers and electric utilities can work together to pursue efficient solutions for improved voltage sag ride-through in semiconductor factories.

The scope of this guide extends beyond a discussion of typical electric utility reliability and quality improvement techniques to developing a continuous improvement process for electric utility voltage sag performance. Factors in this process include the following: Define desired performance criteria by setting goals for voltage sag event duration and magnitude. Measure performance for both proposed and existing semiconductor factory sites. Summarize voltage sag event data and identify the impact on semiconductor processing and facilities infrastructure equipment. Recommend improvements that include consideration of cost, benefit, and risk. Improvements can include corrective action to eliminate system faults, changes to service configurations, and power enhancements. Select and implement improvements. Establish a continuous improvement process. For the purposes of this document, the term Electric Utility refers to energy service providers (that sell energy to semiconductor manufacturers) and/or electric transmission and distribution providers (that deliver energy through their power lines).

Referenced SEMI Standards
SEMI S2 — Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment

Revision History
SEMI F50-0200 (first published)

The purpose of this document is to introduce a basic guide for the use of seals in semiconductor fabrication equipment. Also, to introduce the diverse chemical and physical requirements for the many process applications, and to reduce cost of ownership and improve up-time through the use of appropriate sealing materials. It is important that equipment users, suppliers, OEMs, and seal manufacturers use the same terminology and that communication can take place at the same level so that actual performance of the equipment can be discussed.

This guide is applicable to the use of seals in specific operating environments used in the fabrication of semiconductor devices. The guide will aid in defining the seal parameters for the various process environments. It includes those elastomeric seals that come in contact with process liquids and or gases.

Referenced SEMI Standards
SEMI C3 — Specifications for Gases
SEMI D9 — Definitions for Flat Panel Display Substrates
SEMI E45 — Test Method for the Determination of Inorganic Contamination from Minienvironments
SEMI F21 — Classification of Airborne Molecular Contaminant Levels in Clean Environments
SEMI P5 — Specification for Pellicles
SEMI S4 — Safety Guideline for the Segregation/Separation of Gas Cylinders Contained in Cabinets

Revision History
SEMI F51-0200 (first published)

This document defines sizes and their measurement methods of metric PFA tubes for liquid chemical distribution in semiconductor and liquid crystal display manufacturing equipment and facilities. This document applies to metric tubes made from PFA.

Referenced SEMI Standards
None.

Revision History
SEMI F52-1101 (technical revision)
SEMI F52-0600 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 21, 2006. It was available at www.semi.org in February 2007 and on CD-ROM in March 2007. Originally published June 2000.

The purpose of this document is to define a structured method for testing and evaluating the electromagnetic susceptibility of thermal mass flow controllers.

This document contains the requirements and test method that can be used to evaluate whether a thermal mass flow controller will maintain its functional characteristics when subjected to EMI levels typical of the industry. The test method covers both the radiated susceptibility (RS) and conducted susceptibility (CS) of the controller when exposed to EMI. The electromagnetic susceptibility requirements are extracted from MIL-STD-461C and SAMA PMC-33.1, and the test method is a composite of the RS03, CS01, CS02, and CS06 test methods defined in MIL-STD 462.

Referenced SEMI Standards
None.

Revision History
SEMI F53-0600 (Reapproved 0307)
SEMI F53-0600 (first published)

Particle specifications for gases require the use of condensation nucleus counters (CNCs) having specified counting efficiencies. This document provides the test method for determining the counting efficiencies of CNCs. This document provides the method for 1) generating an aerosol standard consisting of sodium chloride (NaCl) particles having sizes 0.01 micrometer and larger suspended in air at atmospheric pressure (1 ´ 105 Pa), 2) controlling the size and concentration of particles in the aerosol, and 3) using the aerosol to determine the counting efficiency of a CNC as a function of particle size.

This method is suitable for CNCs having a lower size sensitivity of 0.01 micrometer or larger. NOTE: Suitable test methods for calibrating optical particle counters are contained in ASTM F328 and JIS B 9921.

Referenced SEMI Standards
None.

Revision History
SEMI F54-1000 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 21, 2006. It was available at www.semi.org in February 2007 and on CD-ROM in March 2007. Originally published June 2000.

A mass flow controller (MFC) is often used to control corrosive gases under unfavorable conditions. This test method is intended to help differentiate between MFC designs on the basis of relative resistance to corrosion-induced failure.

This test is intended to show the effect of corrosion caused when a corrosive gas such as HCl is contaminated by an oxidizer such as atmospheric moisture. For the purpose of this test HCl is the preferred test gas, however this test can also be performed with other gasses. This test method describes a corrosive gas exposure test for mass flow controllers. The test is intended to accelerate the corrosion while simulating conditions that may be found within process equipment and gas systems in the semiconductor industry. As the relationship between corrosion and performance may differ with MFC design, corrosion is not measured directly. The effects of corrosion are detected by observing changes in MFC calibration and other operating parameters.

Referenced SEMI Standards
SEMI F1 — Specification for Leak Integrity of High-Purity Gas Piping Systems and Components

Revision History
SEMI F55-0600 (Reapproved 0307)
SEMI F55-0600 (technical revision)
SEMI F55-1000 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 21, 2006. It was available at www.semi.org in February 2007 and on CD-ROM in March 2007. Originally published June 2000.

The purpose of this document is to define a method for characterizing mass flow controllers (MFCs) being considered for installation into a high-purity gas distribution system. This method will quantify the steady-state supply voltage effects on the MFC's ability to accurately deliver set point flow values.

This procedure applies to thermal mass flow controllers. It is intended to measure the delivered mass flow rate variation as a function of deviation from the reference steady-state supply voltage. The test method is designed for DC-powered MFCs. The supply voltage effects include voltage depression and over-voltage variations in the DC supply.

Referenced SEMI Standards
None.

Revision History
SEMI F56-0600 (Reapproved 0307)
SEMI F56-0600 (first published)

This document specifies minimum performance requirements for ultrahigh purity (UHP) polymer components used throughout semiconductor ultrapure water and liquid chemical distribution systems including bulk supply, facility distribution, and process equipment applications. Polymer component purity and mechanical specifications are included in this standard along with references for qualification test methods. Certification, traceability, and packaging requirements are also included.

Referenced SEMI Standards
SEMI E49.7 — Guide for Subsystem Assembly and Testing Procedures - Polymer Systems
SEMI F40 — Practice For Preparing Liquid Chemical Distribution Components for Chemical Testing
SEMI S2 — Safety Guideline for Semiconductor Manufacturing Equipment

Revision History
SEMI F57-0301 (technical revision)
SEMI F57-1000 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 13, 2008. It was available at www.semi.org in June 2008 and on CD-ROM in July 2008. Originally published October 2000.

This document describes the procedure for determination of the moisture dry-down characteristics (quantity of removable moisture) of surface mount and conventional gas distribution systems (integrated gas distribution systems). APIMS is currently the method of choice for such dynamic tests because it is the commercially available technique capable of ppt moisture analysis with the fastest response time. This test method may provide guidelines for the application of other techniques with similar detection limits and response time to APIMS which may not be commercially available at this time.

The results of this test can be used for qualitative ranking of gas delivery system based on the design. It can also be used by a sufficiently sophisticated user as input for numerical simulation of a gas distribution system behavior.

This test method applies to all types of surface mount and conventional gas distribution systems used in semiconductor processing.

Test Medium — The test procedure will be carried out in nitrogen. Other “inert” gases will have different purging characteristics and may dry a system more quickly or slowly. Reactive gases may react chemically with moisture. Considerations relating to corrosion resistance are outside the scope of the present document, although the test procedure may prove useful in corrosion studies. The results will provide a ranking with respect to moisture contribution arising as a result of differences in design, which may be applied with due caution to systems intended for use in other gas applications.

Operating Situations — Moisture contribution from a gas delivery system may be the result of contamination arising in its manufacture, or from subsequent exposure to ambient air or non-dry gas. Thus, it is necessary to consider two main situations:

The “initial dry-down” situation, which is determined by the moisture content of the components in the system (as received) with the effects of manufacturing process and design, surface quality, pre-treatment and packaging convoluted together.

The “response to upset” situation, which is determined by the amount of moisture taken up by the system and subsequently released in any exposure after receipt.

Referenced Standards:
SEMI C15 — Test Method for ppm and ppb Humidity Standards
SEMI F27 — Test Method for Moisture Interaction and Content of Gas Distribution Systems and Components by Atmospheric Pressure Ionization Mass Spectrometry (APIMS)
SEMI F33 — Method for Calibration of Atmospheric Pressure Ionization Mass Spectrometer (APIMS)

Revision History:
SEMI F58-0708 (technical revision)
SEMI F58-1000 (first published)

NOTE: This document was entirely rewritten for publication in 2002.

The purpose of this document is to define a method for testing filters or gas systems being considered for installation into a high-purity gas distribution system or on semiconductor manufacturing equipment, respectively. Application of this test method is expected to yield comparable data among filters or gas systems. This document establishes a test method for preparing a pressure drop versus flow rate curves for filters and gas systems.

This procedure applies to clean filters including those cartridges of metal, ceramic and membrane construction. The pressure drops for integral housing/cartridge combination units are determined as a single set of values. For housings with removable filter cartridges, the flow curves of the housing and housing/cartridge combination are determined separately.

This procedure applies to high-purity gas systems. This procedure applies to face-seal, surface mount—modular, and monolithic integrated gas systems.

Referenced SEMI Standards
None.

Revision History
SEMI F59-0302 (technical revision)
SEMI F59-1000 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 29, 2005. It was available at www.semi.org in February 2006 2005 and on CD-ROM in March 2006. Originally published March 2001.

NOTICE: This document was completely rewritten in 2006.

The purpose of this document is to define a method for testing passivated 316L stainless steel components being considered for installation into a high-purity gas distribution system. Application of this test method is expected to yield comparable results among components tested for the purposes of qualification for this installation. This document defines a method of testing the interior surfaces of stainless steel tubing, fittings, valves, and other components to determine the surface composition and chemistry, as a measure of the effectiveness of passivation processes. The objective of this method is to describe a general set of instrument parameters and conditions that will achieve precise and reproducible measurements of important surface chemistry within the chromium-enriched oxide layer.

This document describes a test method to characterize "as received" surface composition and chemistry encompassing all chromium-enriched stainless steel surfaces in tubing, fittings, valves, and other components. This procedure involves measurement of total Cr/Fe ratios, CrOX/FeOX oxide species ratios, and the surface elemental compositions by Electron Spectroscopy for Chemical Analysis (ESCA), also called X-ray Photoelectron Spectroscopy (XPS). This document also describes the test method for a compositional ESCA depth profile measurement for Cr, Fe, Ni, O and C from the as-received surface, through the oxide layers, and extending into the base metal. The depth profile measurement evaluates the oxide thickness and the relative composition throughout the modified surface layer as a result of the passivation process.

Referenced SEMI Standards
SEMI F19 — Specification for the Finish of the Wetted Surfaces of Electropolished 316L Stainless Steel Components

Revision History
SEMI F60-0306 (complete rewrite)
SEMI F60-0301 (first published)

This guide establishes the typical definitional requirements for an ultrapure water (UPW) system used in semiconductor manufacturing. It is intended to establish a common basis for developing detailed specifications in subsequent documents concerning design, performance and certification and monitoring of UPW systems.

This document may be used by users and suppliers as a basis for developing site-specific UPW specifications and performance criteria. This guide applies to ultrapure water systems used in semiconductor manufacturing facilities for supplying high purity water for chemical dilutions, wafer processing and other manufacturing processes.

This guide can be used to understand the design elements and functionality of all UPW systems, which includes a Reverse Osmosis (RO) and a Deionization (DI) process. However, it is most applicable to newer designed UPW systems that support submicron linewidth device manufacturing.

Referenced SEMI Standards
None.

Revision History
SEMI F61-0301 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 21, 2006. It was available at www.semi.org in February 2007 and on CD-ROM in March 2007. Originally published July 2001.

The purpose of this document is to define a method for testing MFCs being considered for installation into a gas distribution system and to quantify ambient and gas temperature effects on the MFC's indicated and actual flow.

This test method applies to metal and polymer sealed MFCs with flow rates up to 30 slpm. The tests include those listed below and are to be performed in the following order:
1. Ambient Temperature Effects (Steady State and Transient)
2. Gas Temperature Effects (Steady State and Transient)

Referenced SEMI Standards
None.

Revision History
SEMI F62-0701 (Reapproved 0307)
SEMI F62-0701 (first published)

This guide is provided for multiple purposes. It may be used as a basis for establishing performance criteria for purchases of new UPW equipment. It may also be used internally by facility engineers to set process control parameters for the operation of their UPW systems.

This guide may be used by process engineers to establish reasonable expectations about the quality of the UPW being supplied to them by facilities. Water is used extensively in the production of semiconductor devices for all wet processing steps such as the rinsing of wafers. Ultrapure Water (UPW) is typically produced for this purpose using Reverse Osmosis/Deionized resin bed technologies. The quality of the water impacts device yield and as linewidths decrease, requirements for higher purity water may increase.

NOTICE: These suggested guidelines are published as technical information and are intended for informational purposes only.

Referenced SEMI Standards
SEMI F61 — Guide For Ultrapure Water System Used in Semiconductor Processing

Revision History
SEMI F63-0701 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 21, 2006. It was available at www.semi.org in February 2007 and on CD-ROM in March 2007. Originally published July 2001.

The purpose of this document is to define a method for characterizing a MFC being considered for installation into a gas distribution system. This method will quantify the effect of transient and steady state inlet and outlet pressure conditions on the performance of the MFC.

This document provides a common basis for communication between manufacturers and users regarding testing and describing MFC pressure effects.

This test method measures the upstream (inlet) and downstream (outlet) transient pressure influences on indicated and actual flow.

This test method yields the results of actual output flow versus MFC set-point and indicated flow as influenced by steady state inlet pressure.

This test method applies to MFCs with maximum flow ranges of up to 1000 sccm.

NOTE: Due to the higher sensitivity of lower flow rate MFC’s when pressure transients occur, the flow range for this document is limited to 1000 sccm.

Referenced SEMI Standards
None.

Revision History
SEMI F64-0701 (Reapproved 0307)
SEMI F64-0701 (first published)

This document specifies dimensions of mounting base and their clearance hole sizes for bolts and the hole locations of diaphragm valves used with metric PFA tubes in liquid chemical distribution facilities and process equipment for semiconductor and flat panel display manufacturing. To avoid any disturbance of future development and to facilitate interchangeability of diaphragm valves, this document has a limited scope as specified in Section 2.

This document applies to mounting bases for two way valves with a diaphragm designed to shut off and/or regulate a liquid chemical flow in tubes whose sizes are listed in Table 1. The valves are made from materials such as PTFE or PFA, which have high corrosion resistance and low contamination contribution to the fluid.

Referenced SEMI Standards
None.

Revision History
SEMI F65-1101 (first published)

This document specifies port marking and symbol of stainless steel vessels for liquid chemicals used in semiconductor and flat panel display manufacturing equipment and liquid chemical distribution facilities.

This document covers stainless steel vessels with tubes that penetrate into the vessels as inlets or outlets of liquid chemical to/from the vessels. A vessel which uses coupling (quick coupling) at its tube end (port) is excepted from the scope.

Referenced SEMI Standards
None.

Revision History
SEMI F66-1101 (first published)

The purpose of this document is to define a test method to quantify impurity removal capacity of inert gas purifiers. To determine the impurity capacity of a gs purifier at the point of breakthrough. Capcity tests are done by adding ppm levels of a given gaseous impurity to a pure zero gas and monitoring the effluent of the test purifier for active impurity species.

NOTE 1: Mixtures of two or more impurities for multi impurity removal purifiers is a more representative method for determining capacity.

This document is intended for point of use (POU) inert gas purifiers where inlet purity is 99.9995% or higher.

Referenced SEMI Standards
SEMI E29 — Standard Terminology for the Calibration of Mass Flow Controllers and Mass Flow Meters
SEMI F6 — Guide for Secondary Containment of Hazardous Gas Piping Systems
SEMI F22 — Guide for Gas Distribution Systems
SEMI F33 — Method for Calibration of Atmospheric Pressure Ionization Mass Spectrometer (APIMS)

Revision History
SEMI F67-1101 (first published)

The purpose of this document is to define a test method to quantify the efficiency of a purifier for removal of an active gaseous impurity from a matrix gas.

To determine the efficiency of a gas purifier to remove a given impurity species. Efficiency tests are performed by adding ppm levels of gaseous impurities to a pure matrix gas and monitoring the effluent of the test purifier for active impurity species. Tests are done at supplier recommended flow rate, operating temperature and pressure. To establish a method of determining instantaneous purifier efficiency. The test method applies to point of use (POU) and large scale purifiers. This method is for UHP efficient removal of the low level contaminants.

Referenced SEMI Standards
SEMI E29 — Standard Terminology for the Calibration of Mass Flow Controllers and Mass Flow Meters
SEMI F6 — Guide for Secondary Containment of Hazardous Gas Piping Systems
SEMI F22 — Guide for Gas Distribution Systems
SEMI F33 — Method for Calibration of Atmospheric Pressure Ionization Mass Spectrometer (APIMS)

Revision History
SEMI F68-1101 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 13, 2008. It was available at www.semi.org in June 2008 and on CD-ROM in July 2008. Originally published March 2002.

This document provides test methods for qualifying the mechanical integrity of gas delivery systems through vibration and shock testing.

The test methods recommended herein provide for vibration (transport simulation) and shock testing of gas delivery systems including conventional and surface-mount) for semiconductor processing.

The test methods recommended herein apply to gas delivery systems not crated or packaged for shipment. Specifically, the test methods are to be applied to the assembled and interconnected gas delivery components and their associated mounting panel (back plane), with or without a sheet metal enclosure.

For the purpose of this guideline, transportation vibration, and its simulation, are expectedly more severe than in-use vibrational levels. Thus the transportation simulation test is considered acceptable to assess mechanical integrity adequate for both shipment and life-cycle vibrational stress of the gas delivery systems.

The intent of the shock test is to provide further assessment of equipment malfunction that may result from shocks experienced during unpacking, installation, or use in the field.

Successful completion of the tests recommended herein is a recommended metric of mechanical integrity for gas delivery systems architecture, design, and assembly techniques.

Referenced Standards:
SEMI F1 — Specification for Leak Integrity of High-Purity Gas Piping Systems and Components

Revision History:
SEMI F69-0708 (technical revision)
SEMI F69-0302 (first published)

The purpose of this document is to provide a standardized methodology and procedure for measuring the particle contribution performance of a gas delivery system in terms of number of particles added to gas flowing through the system. This standardized procedure is intended to be used commonly by the component suppliers, gas suppliers, equipment suppliers, and users. This test method applies to all types of surface mount and conventional gas delivery systems used in semiconductor manufacturing facilities and comparable research and development areas.

Referenced SEMI Standards
None.

Revision History
SEMI F70-0302 (first published)

This guideline was technically approved by the Global Facilities Committee and is the direct responsibility of the Japan Facilities Committee. Current edition approved by the Japan Regional Standards Committee on July 19, 2002. Initially available at www.semi.org September 2002; to be published November 2002.

The purpose of this document is to provide a standardized methodology and procedure for the leakage performance of gas delivery systems temperature cycling. This test method applies to gas delivery systems installed in semiconductor manufacturing equipment.

Referenced SEMI Standards
SEMI F1 — Specification for Leak Integrity of High-Purity Gas Piping System and Components

Revision History
SEMI F71-1102 (first published)

This test method was technically approved by the Global Gases Committee and is the direct responsibility of the North American Gases Committee. Current edition approved by the North American Regional Standards Committee on July 21, 2002. Initially available at www.semi.org October 2002; to be published November 2002.

The purpose of this document is to define a test method to characterize the surface composition of passivated 316L stainless steel components being considered for installation into a high-purity gas distribution system.

This test method is intended to be applied to the wetted surfaces of stainless steel tubing, fittings, valves, and other components as a measure of the effectiveness of passivation. The objective of this method is to describe a general set of instrument parameters and conditions that will achieve reproducible measurements within the chromium-enriched passive oxide layer. This document describes a test method to characterize the composition and thickness of the chromium-enriched oxide layer of stainless steel surfaces and to detect surface contamination in tubing, fittings, valves and other components. The procedure involves detection and measurement of the surface elemental composition by Auger Electron Spectroscopy (AES).

This procedure also describes the test method for a depth compositional profile of Cr, Fe, Ni, O, and C from the as-received surface, through the oxide layers, and extending into the base metal. This measurement provides oxide thickness and chromium enrichment information throughout the passivated region.

Referenced SEMI Standards
None.

Revision History
SEMI F72-1102 (first published)

This test method was technically approved by the Global Gases Committee and is the direct responsibility of the North American Gases Committee. Current edition approved by the North American Regional Standards Committee on August 29, 2002. Initially available at www.semi.org September 2002; to be published November 2002.

This document defines a uniform procedure for testing the wetted surfaces of stainless steel components intended for installation into high purity gas distribution systems. This procedure characterizes the occurrence, frequency, and in some cases the identity of microscopic surface defects and contaminants that may appear on the wetted surfaces. It should be noted that there has been no direct correlation made between the results of this test method and contamination of process gases or product yields in processes served by high purity gas distribution systems. Application of this test method is intended to yield comparable and reproducible results among various users of this method for the purposes of qualification of components. The objective of this method is to describe a general set of instrument parameters and conditions that will achieve precise and reproducible measurements of important parameters regarding the surface condition.

This procedure applies to the wetted surfaces in stainless steel tubing, fittings, valves, and other components to determine the effectiveness of surface finishing and cleaning processes. The technique describes counting of surface defects including pits, inclusions, inclusion stringers, scratches, residual process marks, grain boundaries and contamination on the wetted surfaces. However, any surface damage produced during sample preparation is to be excluded from such assessment.

Referenced SEMI Standards
None.

Revision History
SEMI F73-1102 (first published)

This document is a test method for evaluating metal seal designs use in gas delivery systems. It covers both surface-mounted gas systems and conventional metal face seal fitting systems. The test methods apply to the connection seals used in conventional tubing type gas systems and between modules and components to the substrates used in surface-mounted gas systems.

Referenced SEMI Standards
SEMI E49 — Guide for Standard Performance, Practices, and Sub-Assembly for High Purity Piping Systems and Final Assembly for Semiconductor Manufacturing Equipment
SEMI F1 — Specification for Leak Integrity of High-Purity Gas Piping Systems and Components

Revision History
SEMI F74-1103 (technical revision)
SEMI F74-1102 (first published)

This guide was technically approved by the Global Facilities Committee and is the direct responsibility of the North American Facilities Committee. Current edition approved by the North American Regional Standards Committee on August 29, 2002. Initially available at www.semi.org September 2002; to be published November 2002.

These guides provide recommendations for facility engineers and other manufacturing and quality professionals who may be responsible for establishing programs to monitor and control the quality of their ultrapure water (UPW) systems through to point-of-use (POU). These guides may be used to help determine the parameters that should be monitored for UPW that is produced, distributed and used throughout the manufacturing facility, and the frequency and location of testing. (NOTE: These suggested guides are published as technical information and are intended for informational purposes only.) UPW is used extensively in the production of semiconductor devices for all wet processing steps. Ultrapure water systems need to be tested and monitored to ensure that the UPW being produced matches the specifications established by the manufacturing process. The purity of the UPW may affect device yield unless a wide range of parameters is closely controlled at the point of distribution (POD). Semiconductor devices are currently being designed with smaller linewidths (<0.13–0.18 m) and are more susceptible to low level impurities. UPW systems are monitored for continuous performance for desired and achievable levels of quality. Action limits are generally set to determine when system performance data warrants that corrective action is needed. Table 1 Parameters and Range of Performance in SEMI F63 may be a useful reference for establishing quality levels. In more critical processes, the quality of the UPW also needs to be monitored at the POU where the UPW is in contact with the wafer. The quality of the UPW should not be expected to be identical to the quality of the UPW being produced at final filter (FF), which is not subject to conditions within the tool or distribution system.

These guides logically follow the series of SEMI guides developed for UPW, which include a standard defining the performance of a UPW system, and a standard defining the quality of UPW (see reference section). The Schematic of a Typical Ultrapure Water System in Figure 1 of SEMI F61 may be a useful reference for determining sampling points. Guides are provided concerning the frequency and location of sampling for those parameters that are not available from on-line analyzers. Frequency of sampling should be based on the specifications set by manufacturing for the quality of the POD UPW, the number and locations of on-line analyzers, the stability of the incoming feed water to the system, and the historical performance of the UPW system over time. These guides may also be used to establish process control criteria for the incoming feedwater, performance of UPW system components and POU rinse baths.

Referenced SEMI Standards
SEMI F61 — Guide for Ultrapure Water System Used in Semiconductor Processing
SEMI F63 — Guidelines for Ultrapure Water Used in Semiconductor Processing

Revision History
SEMI F75-1102 (first published)

This is a test method to compare gas handling components for potential particle generation in corrosive gas service. It is intended as a practical means of generating performance data for a group of components to be compared in a selection process. This method applies to valves, particle filters, and low pressure regulators.

Referenced SEMI Standards
SEMI E66 — Test Method for Determining Particle Contribution by Mass Flow Controllers

Revision History
SEMI F76-0303 (first published)

The purpose of this test method is to determine the relative resistance to pitting corrosion of the wetted surfaces of components intended for use in corrosive gas distribution systems for semiconductor manufacturing. This test method is intended to differentiate between alloy compositions and processes intended to enhance the corrosion performance of the wetted surfaces.

This test method describes a procedure, based on the electrochemical critical pitting temperature (CPT), which is used to rank the pitting corrosion resistance of wetted surfaces of tubing or test coupons of representative finished surfaces intended for use in corrosive gas systems. Pitting corrosion is believed to be a major corrosion failure mode in semiconductor gas delivery systems, particularly in components and tubing welded and exposed to corrosive gases. This test method is an adaptation of ASTM G150. The adaptation describes a method for performing the test method on coupons or wetted-surface sections cut from gas supply system components such as tubing. It is an aqueous immersion method. The test method is reproducible and provides a metric (critical pitting temperature) in addition to a qualitative (visual) evaluation of corrosion resistance.

This test method applies to materials as specified in SEMI Standards referenced in Section 4.1, and to welds of these materials. This test method may also be used for other corrosion resistant alloys and their welds not referenced in Section 4.1.

Referenced SEMI Standards
SEMI F19 — Specification for the Finish of the Wetted Surfaces of Electropolished 316L Stainless Steel Components
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F77-0703 (first published)

The purpose of this practice is to provide procedures for welding stainless steels and other corrosion resistant metals and alloys (CRAs) for fluid (liquid or gas) distribution systems in semiconductor manufacturing applications. Welds performed following these procedures are of sufficient quality to provide the required system purity, weld integrity, and weld strength for use in semiconductor manufacturing applications.

This practice provides procedures for gas tungsten arc (GTA) autogenous butt joint welds of stainless steel and other CRAs in fluid distribution systems. The fluid distribution system includes tubing, pipe, fittings, valves, subassemblies and components that contain and distribute fluid.

Referenced SEMI Standards
SEMI F81 — Specification for Visual Inspection and Acceptance of Gas Tungsten Arc (GTA) Welds in Fluid Distribution Systems in Semiconductor Applications
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F78-0304 (technical revision)
SEMI F78-0703 (first published)

The purpose of this guideline is to identify resource information on compatibility of gases in contact with silicon in the wetted path of a gas delivery system operating at typical gas stick conditions. The information and conclusions provided are taken from published literature. References are cited. No opinion is made as to the validity of the published conclusions. The suggestions are specific to high purity silicon, single or poly crystal, covered by native oxide.

Referenced SEMI Standards
SEMI E52 — Practice for Referencing Gases Used in Digital Mass Flow Controllers

Revision History
SEMI F79-0703 (first published)

This document is a guide to a test method to determine gas change/purge efficiency of gas delivery system. It covers both conventional metal face sealing and surface mount gas delivery systems. The test method applies to all type of high purity gas delivery systems used in semiconductor manufacturing facilities and comparable research and development areas.

Referenced SEMI Standards
None.

Revision History
SEMI F80-1103 (first published)

The purpose of this specification is to provide visual inspection and acceptance criteria for gas tungsten arc (GTA) welds of stainless steel and other corrosion resistant metals and alloys (CRAs) in fluid (liquid or gas) distribution systems in semiconductor manufacturing applications. These criteria are meant to ensure that welds are of sufficient quality to provide the required system purity, weld integrity, and weld strength for use in semiconductor manufacturing applications.

This specification defines inspection and acceptance criteria for GTA autogenous butt joint welds of stainless steel and other CRAs in fluid distribution systems. The fluid distribution system includes tubing, pipe, fittings, valves, subassemblies and components that contain and distribute fluid.

Referenced SEMI Standards
SEMI F78 — Practice for Gas Tungsten Arc (GTA) Welding of Fluid Distribution Systems in Semiconductor Manufacturing Applications

Revision History
SEMI F81-1103 (first published)

This standard establishes the properties and physical dimensions of mass flow controllers and mass flow meters for 1.125 inch type surface mount gas distribution systems. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components.

This standard applies to all mass flow controllers and mass flow meters. The components are mounted on substrates with fasteners accessible from the top.

This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia). This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F82-0304 (first published)

This standard establishes the properties and physical dimensions of two port components for 1.125 inch type surface mount gas distribution systems. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components.

This standard applies to all two port two fastener components (except mass flow controllers and mass flow meters). The components (i.e. valves, pressure regulators, pressure transducers, filters and purifiers) are mounted on substrates with fasteners accessible from the top.

This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia). This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F83-0304 (first published)

This standard establishes the properties and physical dimensions of three port components for 1.125 inch type surface mount gas distribution systems. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components.

This standard applies to all three port two fastener components (except mass flow controllers and mass flow meters). The components (i.e., valves, pressure regulators, pressure transducers, filters and purifiers) are mounted on substrates with fasteners accessible from the top. This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia).

This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High PuritySemiconductor Manufacturing Applications

Revision History
SEMI F84-0304 (first published)

This standard establishes the properties and physical dimensions of one port components for 1.125 inch type surface mount gas distribution system. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components.

This standard applies to all one port four fastener components. The components are mounted on substrates with fasteners accessible from the top. This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia).

This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F85-0304 (first published)

This standard establishes the properties and physical dimensions of two port components for 1.125 inch type surface mount gas distribution system. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components.

This standard applies to all two port four fastener components (except mass flow controllers and mass flow meters). The components (i.e. valves, pressure regulators, pressure transducers, filters and purifiers) are mounted on substrates with fasteners accessible from the top. This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia).

This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F86-0304 (first published)

This standard establishes the properties and physical dimensions of two port components for 1.125 inch type surface mount gas distribution system. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components.

This standard applies to all three port four fastener components (except mass flow controllers and mass flow meters). The components (i.e. valves, pressure regulators, pressure transducers, filters and purifiers) are mounted on substrates with fasteners accessible from the top. This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia).

This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F87-0304 (first published)

E This document was modified in May 2004 with committee approval to correct an error made at the pre-ballot stage. Changes were made to Figure R1-2.

This standard establishes the properties and physical dimensions of mass flow controllers and mass flow meters for 1.5 inch type surface mount gas distribution systems. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components. This standard applies to all standard size mass flow controllers and mass flow meters. The components are mounted on substrates with fasteners accessible from the top.

This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia). This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F88-0304E (editorial revision)
SEMI F88-0304 (first published)

E This document was modified in May 2004 with committee approval to correct an error made at the pre-ballot stage. Changes were made to Figure R1-2.

This standard establishes the properties and physical dimensions of mass flow controllers and mass flow meters for 1.5 inch type surface mount gas distribution systems. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components. This standard applies to all compact size mass flow controllers and mass flow meters. The components are mounted on substrates with fasteners accessible from the top.

This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia). This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F89-0304E (editorial revision)
SEMI F89-0304 (first published)

E This document was modified in May 2004 with committee approval to correct an error made at the pre-ballot stage. Changes were made to Figure R1-2.

This standard establishes the properties and physical dimensions of two port components for 1.5 inch type surface mount gas distribution systems. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components.

This standard applies to all standard size two port two fastener components (except mass flow controllers and mass flow meters). The components (i.e. valves, pressure regulators, pressure transducers, filters and purifiers) are mounted on substrates with fasteners accessible from the top. This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia).

This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F90-0304E (editorial revision)
SEMI F90-0304 (first published)

E This document was modified in May 2004 with committee approval to correct an error made at the pre-ballot stage. Changes were made to Figure R1-2.

This standard establishes the properties and physical dimensions of two port components for 1.5 inch type surface mount gas distribution systems. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components.

This standard applies to all compact size two port two fastener components (except mass flow controllers and mass flow meters). The components (i.e. valves, pressure regulators, pressure transducers, filters and purifiers) are mounted on substrates with fasteners accessible from the top. This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia).

This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F91-0304E (editorial revision)
SEMI F91-0304 (first published)

E This document was modified in May 2004 with committee approval to correct an error made at the pre-ballot stage. Changes were made to Figure R1-2.

This standard establishes the properties and physical dimensions of two port components for 1.5 inch type surface mount gas distribution systems. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components.

This standard applies to all compact size three port two fastener components. The components (i.e. valves, pressure regulators, pressure transducers, filters and purifiers) are mounted on substrates with fasteners accessible from the top. This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia).

This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F92-0304E (editorial revision)
SEMI F92-0304 (first published)

E This document was modified in May 2004 with committee approval to correct an error made at the pre-ballot stage. Changes were made to Figure R1-2.

This standard establishes the properties and physical dimensions of one port components for 1.5 inch type surface mount gas distribution systems. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components.

This standard applies to all one port four fastner components. The components are mounted on substrates with fasteners accessible from the top. This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia).

This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F93-0304E (editorial revision)
SEMI F93-0304 (first published)

E This document was modified in May 2004 with committee approval to correct an error made at the pre-ballot stage. Changes were made to Figure R1-2.

This standard establishes the properties and physical of two port components for 1.5 inch type surface mount gas distribution systems. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components.

This standard applies to all two port four fastener components (except mass flow controllers and mass flow meters). The components (i.e. valves, pressure regulators, pressure transducers, filters and purifiers) are mounted on substrates with fasteners accessible from the top.

This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia). This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F94-0304E (editorial revision)
SEMI F94-0304 (first published)

E This document was modified in May 2004 with committee approval to correct an error made at the pre-ballot stage. Changes were made to Figure R1-2.

This standard establishes the properties and physical of two port components for 1.5 inch type surface mount gas distribution systems. This document includes common requirements, layout, size, detailed specifications, and dimensions of the components.

This standard applies to all three port four fastener components. The components (i.e. valves, pressure regulators, pressure transducers, filters and purifiers) are mounted on substrates with fasteners accessible from the top.

This standard only applies to components, which control flow of 50 slm nitrogen equivalent at 308 kPa (44.7 psia). This standard also only applies to components with operating pressures less than 3445 kPa (500 psia) at 20C.

Referenced SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel Bar, Extruded Shapes, Plate, and Investment Castings for Components Used in High Purity Semiconductor Manufacturing Applications

Revision History
SEMI F95-0304E (editorial revision)
SEMI F95-0304 (first published)

This document specifies the type, size and spacing of connectors to be used on metal (e.g., stainless steel) canisters for liquid chemical precursors, solutions and solvents. This document applies to metal (e.g., stainless steel) canisters to be used for "liquid precursors" (see definition) including solutions of precursors in solvents. It also applies to containers for solvents used for in situ cleaning of delivery system. The liquid connection ports (inlet and outlet) are included, as are pneumatic connections to valves. Parameters such as overall canister dimensions are expected to be specified by other standards.

Referenced SEMI Standards
SEMI F66 — Specification for Port Marking and Symbol of Stainless Steel Vessels for Liquid Chemicals

Revision History
SEMI F96-0704 (first published)

This specification was technically approved by the Global Facilities Committee and is the direct responsibility of the European Global Facilities Committee. Current edition approved by the European Regional Standards Committee on November 10, 2004. Initially available at www.semi.org January 2005; to be published March 2005.

The purpose of this specification is to provide the requirements for the architecture, functionality and interfaces for Facility Monitoring and Control Systems and the various Facility Package Units to enable a standardized and integrated communication between them. This specification is appended with related information to provide application examples.

Background and Motivation Today, the suppliers of Facility Package Units (e.g., chemicals, power supply, gases, HVAC) are often using individual communication concepts. This leads to high efforts to specify the communication structures between Facility Package Units (FPU) and the Facility Monitoring and Control Systems (FMCS), to evaluate the quoted solutions and to eventually integrate these units. These individual, not standardized concepts today are not reusable, bear risks in execution and lead to high maintenance costs. This specification is a first step to standardize the communication between facility and monitoring components. Therefore, it focuses in its scope to a small set of requirements which are common to all FPUs. As this communication concept is adopted by the various FPU suppliers and their customers, more specific standards describing particular FPUs and their services may evolve. Who and what is addressed by this standard.

A standardization of the communication concept between FMCS and FPUs will support Facility Package Unit manufacturers, general contractors, system integrators, purchasers, and control system manufacturers. It will lead to substantially reduced costs, more reliable execution times, and optimized maintenance concepts.

This standard specifies the requirements for the architecture, common services, data, and its semantic meaning to integrate the FPUs into the FMCS. For this purpose, a basic set of common services (operations) between the FMCS and the FPUs are specified to exchange FPU status information and data. In addition, the state models for FPUs are described.

Out of scope for this standard are:
· Services of FMCS provided to interface to Manufacturing Execution Systems or Enterprise Resource Planning Systems,
· Specification of functionality of particular FMCS functions (graphical user interface (GUI), data archives, reporting archives, alarm handling, etc.), and
· The specification of the interface between FPU control level and FPU field level.

Applicability This standard applies to the field of facility management and is targeted for FPU suppliers and FMCS suppliers for systems integration, engineering and commissioning as well as the operation of such systems by the purchasers.

Referenced SEMI Standards
SEMI E6 — Guide for Semiconductor Equipment Installation Documentation
SEMI E30 — Generic Model for Communications and Control of Manufacturing Equipment (GEM)
SEMI E54 — Sensor Actuator Network Standards Series

Revision History
SEMI F97-0305 (first published)

This guide was technically approved by the Global Facilities Committee and is the direct responsibility of the North American Facilities Committee. Current edition approved by the North American Regional Standards Committee on December 10, 2004. Initially available at www.semi.org February 2005; to be published March 2005.

This guide establishes definitional requirements for industrial water systems that reuse water in a semiconductor manufacturing facility. It is intended to establish a common basis for developing detailed specifications in subsequent documents concerning design, performance, optimization, and monitoring of such systems.

This document may be used by users and suppliers as a basis for developing site-specific specifications and performance criteria.

This guide applies to water systems designed for reuse of water including reclaim and recycle, used in semiconductor manufacturing facilities, supplying water to a variety of uses. Such uses include directing waters to the front end of a UPW system, to cooling systems, scrubbers, thermal processes, and to irrigation systems, depending on the quality of the water.

This guide can be used to understand the design elements and functionality of water systems that support reuse of water. Although such systems can be retrofitted into existing manufacturing factories, there is a broader range of opportunities available in new facilities that can be designed with water saving applications in mind.

Referenced SEMI Standards
SEMI E49 — Guide for High Purity and Ultrahigh Purity Piping Performance, Subassemblies, and Final Assemblies
SEMI F63 — Guide for Ultrapure Water System Used in Semiconductor Processing
SEMI S2 — Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment

Revision History
SEMI F98-0305 (first published)

This specification was technically approved by the Global Liquid Chemicals Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on March 11, 2005. It was available at www.semi.org in June 2005 and on CD-ROM in July 2005.

This document specifies the outside dimensions of diaphragm valves used with metric PFA tubes in liquid chemical distribution facilities and process equipment for semiconductor and flat panel display manufacturing.

This specification addresses dimensions of diaphragm valves used with metric PFA tubes except for face-to-face dimensions. Since there are many seizes of fittings being applied to valves, this document doesn’t specify face-to-face dimensions.

These diaphragm valves are limited to pneumatic valves. Specification for manual valves should be separately provided as needed.

These diaphragm valves are used in chemical distribution systems for semiconductor and flat panel display manufacturing.

The valves are made from materials such as PTFE or PFA, which have high corrosion resistance and low contamination contribution to the fluid.

The valves withstand up to 0.2 megapascals (MPa) [29 pounds per square inch (psi)] back pressure.

Referenced SEMI Standards
SEMI F65 — Dimensional Specification for Mounting Bases of Diaphragm Valves Used with Metric PFA Tubes

Revision History
SEMI F99-0705 (first published)

This test method was technically approved by the Global Liquid Chemicals Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on March 11, 2005. It was available at www.semi.org in June 2005 and on CD-ROM in July 2005. This compliance test method presents that the verification of the compatibility of each diaphragm valves for Metric PFA tube simply.

This document specifies the relative orifice that gives the minimum flow coefficient for diaphragm valve for Metric PFA tube.

This compliance test method describes how to verify the flow coefficient of the diaphragm valve by comparing with the relative orifice.

This Specification addresses a capacity of diaphragm valves used with metric PFA tubes.

These diaphragm valves are used in chemical distribution systems for semiconductor and flat panel display manufacturing.

The valves are made from materials such as PTFE or PFA, which have high corrosion resistance and low contamination contribution to the fluid.

The valves withstand up to 0.2 megapascals (MPa) [29 pounds per square inch (psi)] backpressure.

Fully open to fully shut switch over is the objective of the shut-off valve.

Referenced SEMI Standards
None.

Revision History
SEMI F100-0705 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on September 8, 2005. It was available at www.semi.org in October 2005 and on CD-ROM in November 2005.

The purpose of this document is to define a method for testing pressure regulators being considered for installation into gas systems. Application of this test method is expected to yield comparable data among regulators tested for qualification purposes. This document establishes a test method for quantifying regulator performance characteristics.

This test method applies to pressure regulators. The test procedures that measure these characteristics are intended to be performed sequentially, in the order given below. This document specifies test methods, which will allow the regulator manufacturer or user to determine regulator performance for the following characteristics:
· Particle Count
· Leakage
· Creep/Lock up
· Supply Pressure Effect
· Resolution
· Pressure vs. Flow Curve, Hysteresis Curve, and Operating Hysteresis Value
· Repeatability
· Set pressure Stability
· Step Function Transient Response
· Resonance
· Flow Coefficient
· Excess Pressure
· Endurance

This test method provides a common basis for communication between manufacturers and users.

Referenced SEMI Standards
SEMI F1 — Specification for Leak Integrity of High-Purity Gas Piping Systems and Components
SEMI F32 — Test Method for Determination of Flow Coefficient in High Purity Shutoff Valves

Revision History
SEMI F101-1105 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 29, 2005. It was available at www.semi.org in January 2006 and on CD-ROM in March 2006.

This standard establishes the guide for selecting "SPECIFICATIONS FOR DIMENSION OF COMPONENTS FOR SURFACE MOUNT GAS DISTRIBUTION SYSTEMS".

This standard applies to "Specifications For Dimension Of Components For Surface Mount Gas Distribution Systems" (SEMI F82, SEMI F83, SEMI F84, SEMI F85, SEMI F86, SEMI F87, SEMI F88, SEMI F89, SEMI F90, SEMI F91, SEMI F92, SEMI F93, SEMI F94, and SEMI F95).

Referenced SEMI Standards
SEMI F82 — Specification for Dimension of Mass Flow Controller/Mass Flow Meter for 1.125 Inch Type Surface Mount Gas Distribution Systems
SEMI F83 — Specification for Dimension of Two Port Components (Except MFC/MFM) for 1.125 Inch Type Two Fastener Configuration Surface Mount Gas Distribution Systems
SEMI F84 — Specification for Dimension of Three Port Components (Except MFC/MFM) for 1.125 Inch Type Two Fastener Configuration Surface Mount Gas Distribution Systems
SEMI F85 — Specification for Dimension of One Port Components for 1.125 Inch Type Four Fastener Configuration Surface Mount Gas Distribution Systems
SEMI F86 — Specification for Dimension of Two Port Components (Except MFC/MFM) for 1.125 Inch Type Four Fastener Configuration Surface Mount Gas Distribution Systems
SEMI F87 — Specification for Dimension of Three Port Components (Except MFC/MFM) for 1.125 Inch Type Four Fastener Configuration Surface Mount Gas Distribution Systems
SEMI F88 — Specification for Dimension of Standard Size Mass Flow Controllers and Mass Flow Meters for 1.5 Inch Type Surface Mount Gas Distribution Systems
SEMI F89 — Specification for Dimension of Compact Size Mass Flow Controllers and Mass Flow Meters for 1.5 Inch Type Surface Mount Gas Distribution Systems
SEMI F90 — Specification for Dimension of Standard Size Two Port Components (Except MFC/MFM) for 1.5 Inch Type Two Fastener Configuration Surface Mount Gas Distribution Systems
SEMI F91 — Specification for Dimension of Compact Size Two Port Components (Except MFC/MFM) for 1.5 Inch Type Two Fastener Configuration Surface Mount Gas Distribution Systems
SEMI F92 — Specification for Dimension of Compact Size Three Port Components for 1.5 Inch Type Two Fastener Configuration Surface Mount Gas Distribution Systems
SEMI F93 — Specification for Dimension of One Port Components for 1.5 Inch Type Four Fastener Configuration Surface Mount Gas Distribution Systems
SEMI F94 — Specification for Dimension of Two Port Components (Except MFC/MFM) for 1.5 Inch Four Fastener Configuration Type Surface Mount Gas Distribution Systems
SEMI F95 — Specification for Dimension of Three Port Components for 1.5 Inch Four Fastener Configuration Type Surface Mount Gas Distribution Systems

Revision History
SEMI F102-0306 (first published)

This standard was technically approved by the global Liquid Chemicals Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 21, 2006. It was available at www.semi.org in February 2007 and on CD-ROM in March 2007.

This document specifies the maximum outer diameter, maximum height and nominal volume of canisters. The canister, made of stainless steel, which is designed to contain liquid chemicals, is used as a bubbler in process equipment or a container for liquid chemical distribution system in semiconductor/flat panel display manufacturing.

This document applies to the cylindrical canisters made of stainless steel that have a flat bottom or a skirt shaped bottom in order to be stable.

The nominal volume of the canister which is over 40 liters is exempted from the scope.

Referenced SEMI Standards
None.

Revision History
SEMI F103-0307 (first published)

This standard was technically approved by the global Liquid Chemicals Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on September 5, 2007. It was available at www.semi.org in October 2007 and on CD-ROM in November 2007.

This document provides recommended test methods to evaluate and compare components for particle contribution into an Ultrapure Water (UPW) fluid stream. These methods fulfill the particle testing requirements within SEMI F57.

Two methods for evaluating particle contribution are provided.

The rinse test method evaluates performance in a flushing mode while the component is in a static state. It provides an indication of the volume required to bring particle levels to a user-defined specification.

The cycle test method evaluates performance during component cycling and provides an indication of the steady state particle contribution due to cycling.

These test methods apply to liquid chemical and UPW system components intended for use in semiconductor manufacturing tools and ancillary equipment. Components consisting of, but not limited to, those listed in Table 1 can be evaluated with the test methods indicated.

NOTE: These methods are not recommended for filters or pumps.

This document describes methods for measuring particle contribution from components while using UPW as the test media. UPW, for the intents and purposes of this document, is defined as having the minimum requirements as outlined in ¶ 6.4 of this document.

These methods use an in-situ liquid optical particle measurement instrument (OPM) to quantify performance.

Referenced SEMI Standards
SEMI E49.7 — Purity Guide for the Design and Manufacture of Ultrapure Water and Liquid Chemical Systems in Semiconductor Process Equipment
SEMI F57 — Provisional Specification for Polymer Components Used in Ultrapure Water and Liquid Chemical Distribution Systems

Revision History
SEMI F104-1107 (first published)

This standard was technically approved by the global Gases Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 13, 2008. It was available at www.semi.org in June 2008 and on CD-ROM in July 2008. Originally published November 2007.

The purpose of this guide is to document the industry acceptable compatibility of metallic materials with semiconductor process gases.

This guide is applicable to metallic materials that are exposed to process gases within the gas distribution systems of semiconductor manufacturing equipment. It is not applicable to high pressure, bulk delivery systems.

This guide is specific to High Purity and Ultra-High Purity chemical delivery systems.

Referenced Standards:
SEMI E52 — Practice for Referencing Gases, Gas Mixtures, and Vaporizable Materials Used in Digital Mass Flow Controllers
SEMI F19 — Specification for the Surface Condition of the Wetted Surfaces of Stainless Steel Components
SEMI F20 — Specification for 316L Stainless Steel Bar, Forgings, Extruded Shapes, Plate, and Tubing for Components Used in General Purpose, High Purity and Ultra-High Purity Semiconductor Manufacturing Applications

Revision History:
SEMI F105-0708 (technical revision)
SEMI F105-1107 (first published)