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SEMI G001 - Specification for Cerdip Package Constructions
List Price:
$75.00
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$70.00
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Latest revision: 96
SEMI G002 - Specification for Metallic Leadframes for Cer-Dip Packages
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$75.00
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$70.00
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Latest revision: 94
SEMI G003 - Specification for Sidebrazed Laminates
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$75.00
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$70.00
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Latest revision: 90
SEMI G004 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
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$75.00
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$70.00
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Latest revision: 0302
SEMI G005 - Standard for Ceramic Chip Carriers
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$75.00
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$70.00
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Latest revision: 87
SEMI G006 - Test Method for Seal Ring Flatness
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$75.00
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$70.00
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Latest revision: 89
SEMI G008 - Test Method for Gold Plating
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$75.00
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Latest revision: 94
SEMI G009 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages
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$75.00
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Latest revision: 89
SEMI G010 - Standard Method for Mechanical Measurement of Plastic Package Leadframes
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$75.00
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Latest revision: 96
SEMI G011 - Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds
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$75.00
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Latest revision: 88
SEMI G013 - Standard Test Method for Expansion Characteristics of Molding Compounds
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$75.00
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$70.00
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Latest revision: 88
SEMI G014 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling
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$75.00
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Latest revision: 88
SEMI G015 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds
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$75.00
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$70.00
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Latest revision: 93
SEMI G016 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling
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$75.00
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$70.00
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Latest revision: 88
SEMI G018 - Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes
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$75.00
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$70.00
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Latest revision: 96
SEMI G019 - Specification for Dip Leadframes Produced by Etching
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$75.00
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$70.00
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Latest revision: 0997
SEMI G020 - Specification for Lead Finishes for Plastic Packages (Active Devices Only)
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$75.00
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$70.00
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Latest revision: 96
SEMI G021 - Specification for Plating Integrated Circuit Leadframes
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$75.00
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$70.00
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Latest revision: 94
SEMI G022 - Specification for Ceramic Pin Grid Array Packages
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$75.00
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$70.00
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Latest revision: 1296
SEMI G023 - Test Method of Inductance for Internal Traces of Semiconductor Packages
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$75.00
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$70.00
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Latest revision: 0996
SEMI G024 - Test Method for Measuring the Lead-to-Lead and Loading Capacitance of Package Leads
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$75.00
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$70.00
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Latest revision: 89
SEMI G025 - Test Method for Measuring the Resistance of Package Leads
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$75.00
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$70.00
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Latest revision: 89
SEMI G026 - Specification for Hermetic Slam Chip Carrier Lids
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$75.00
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$70.00
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Latest revision: 90
SEMI G027 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages
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$75.00
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$70.00
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Latest revision: 89
SEMI G028 - Specification for Leadframes for Plastic Molded S.O. Packages
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$75.00
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$70.00
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Latest revision: 0997
SEMI G029 - Test Method for Trace Contaminants in Molding Compounds
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$75.00
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Latest revision: 1296E
SEMI G030 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages
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$75.00
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$70.00
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Latest revision: 88
SEMI G031 - Test Method for Determining the Abrasive Characteristics of Molding Compounds
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$75.00
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$70.00
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Latest revision: 0997
SEMI G032 - Guideline for Unencapsulated Thermal Test Chip
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$75.00
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$70.00
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Latest revision: 94
SEMI G033 - Specification for Pressed Ceramic Pin Grid Array Packages
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$75.00
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$70.00
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Latest revision: 90
SEMI G034 - Specification for Cer-Pack Package Constructions, Including Leadframes, Suitable for Automated Assembly by End Users
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$75.00
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$70.00
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Latest revision: 89
SEMI G035 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices
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$75.00
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$70.00
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Latest revision: 87
SEMI G036 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling
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$75.00
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Latest revision: 88
SEMI G037 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling
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$75.00
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$70.00
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Latest revision: 88
SEMI G038 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
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$75.00
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$70.00
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Latest revision: 0996 (Reapproved 1104)
SEMI G039 - Specification for Brazed Lead Flatpack Constructions, Including Leadframes, Suitable for Automated Assembly
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$75.00
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$70.00
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Latest revision: 89
SEMI G041 - Specification for Dual Strip SOIC Leadframe
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$75.00
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$70.00
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Latest revision: 87
SEMI G042 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages
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$75.00
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Latest revision: 0996 (Reapproved 1104)
SEMI G043 - Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages
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$75.00
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$70.00
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Latest revision: 87
SEMI G044 - Specification for Lead Finishes for Glass to Metal Seal Ceramic Packages (Active Devices Only)
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$75.00
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$70.00
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Latest revision: 94
