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SEMI International Standards
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SEMI P001 - Specification for Hard Surface Photomask Substrates
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Latest revision: 0708
SEMI P002 - Specification for Chrome Thin Films for Hard Surface Photomasks
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Latest revision: 0308
SEMI P003 - Specification for Photoresist/E-Beam Resist for Hard Surface Photoplates
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Latest revision: 0308
SEMI P005 - Specification for Pellicles
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Latest revision: 0704
SEMI P006 - Specification for Registration Marks for Photomasks
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Latest revision: 88 (Reapproved 0707)
SEMI P007 - Method of Viscosity Determination, Method A - Kinematic Viscosity
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Latest revision: 0997 (Reapproved 1103)
SEMI P008 - Method for the Determination of Water in Photoresist
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Latest revision: 0997
SEMI P009 - Guideline for Functional Testing of Microelectronic Resists
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Latest revision: 0298
SEMI P010 - Specification of Data Structures for Photomask Orders
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Latest revision: 0708
SEMI P011 - Test Method for Determination of Total Normality for Alkaline Developer Solutions
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Latest revision: 0308
SEMI P012 - Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresists by Inductively Coupled Plasma Emission Spectroscopy (ICP)
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Latest revision: 0997
SEMI P013 - Determination of Sodium and Potassium in Positive Photoresists by Atomic Absorption Spectroscopy
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Latest revision: 91 (Reapproved 1104)
SEMI P014 - Determination of Tin in Positive Photoresists by Graphite Furnace Atomic Absorption Spectroscopy
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Latest revision: 0997
SEMI P015 - Determination of Sodium and Potassium in Positive Photoresist Metal Ion Free (MIF) Developers by Atomic Absorption Spectroscopy
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Latest revision: 92 (Reapproved 1104)
SEMI P016 - Determination of Tin in Positive Photoresist Metal Ion Free (MIF) Developers by Graphite Furnace Atomic Absorption Spectroscopy
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Latest revision: 92 (Reapproved 1104)
SEMI P017 - Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresist Metal Ion Free (MIF) Developers by Inductively Coupled Plasma Emission Spectroscopy (ICP)
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Latest revision: 92 (Reapproved 0299)
SEMI P018 - Specification for Overlay Capabilities of Wafer Steppers
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Latest revision: 92 (Reapproved 1104)
SEMI P019 - Specification for Metrology Pattern Cells for Integrated Circuit Manufacture
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Latest revision: 92 (Reapproved 0707)
SEMI P020 - Guideline for Catalog Publication of EB Resist Parameters (Proposal)
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Latest revision: 0703
SEMI P021 - Guidelines for Precision and Accuracy Expression for Mask Writing Equipment
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Latest revision: 92 (Reapproved 0703)
SEMI P022 - Guideline for Photomask Defect Classification and Size Definition
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Latest revision: 0307
SEMI P023 - Guidelines for Programmed Defect Masks and Benchmark Procedures for Sensitivity Analysis of Mask Defect Inspection Systems
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Latest revision: 0200 (Reapproved 1107)
SEMI P024 - CD Metrology Procedures
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Latest revision: 94 (Reapproved 1104)
SEMI P025 - Specification for Measuring Depth of Focus and Best Focus
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Latest revision: 94 (Reapprved 1104)
SEMI P026 - Parameter Checklist for Photoresist Sensitivity Measurement
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Latest revision: 0703
SEMI P027 - Parameter Checklist for Resist Thickness Measurement on a Substrate
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Latest revision: 96 (Reapproved 0703)
SEMI P028 - Specification for Overlay-Metrology Test Patterns for Integrated-Circuit Manufacture
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Latest revision: 96 (Reapproved 0707)
SEMI P029 - Specification for Characteristics Specific to Attenuated Phase Shift Masks and Masks Blanks
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Latest revision: 1105
SEMI P030 - Practice for Catalog Publication of Critical Dimension Measurement Scanning Electron Microscopes (CD-SEM)
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Latest revision: 0997 (Reapproved 1104)
SEMI P031 - Practice for Catalog Publication for Chemical Amplified (CA) Photoresist Parameter
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Latest revision: 0304
SEMI P032 - Test Method for Determination of Trace Metals in Photoresist
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Latest revision: 1104
SEMI P034 - Specification for 230 mm Square Photomask Substrates
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Latest revision: 0200 (Reapproved 0707)
SEMI P035 - Terminology for Microlithography Metrology
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Latest revision: 1106
SEMI P036 - Guide for Magnification Reference for Critical Dimension Measurement Scanning Electron Microscopes (CD-SEMS)
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Latest revision: 0308
SEMI P037 - Specification for Extreme Ultraviolet Lithography Mask Substrates
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Latest revision: 1102
SEMI P038 - Specification for Absorbing Film Stacks and Multilayers on Extreme Ultraviolet Lithography Mask Blanks
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Latest revision: 1103
SEMI P039 - OASIS(TM) - Open Artwork System Interchange Standard
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Latest revision: 0308
SEMI P040 - Specification for Mounting Requirements and Alignment Reference Locations for Extreme Ultraviolet Lithography Masks
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Latest revision: 1103
SEMI P041 - Specification for Mask Defect Data Handling with XML, Between Defect Inspection Tools, Repair Tools, and Review Tools
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Latest revision: 0304E
SEMI P042 - Specification of Reticle Data for Automatic Recipe Transfer to Wafer Exposure System
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Latest revision: 0304